Thermal drift analysis using a multiphysics model of bulk silicon MEMS capacitive accelerometer

Dai, Gang; Li, Mei; He, Xiaoping; Du, Lianming; Shao, Beibei; Su, Wei

doi:10.1016/j.sna.2011.09.016

Cited by 70 publications

(33 citation statements)

References 7 publications

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“…For MEMS, there has always been a demand for device performance improvement that has inspired a subsequent search for thin film materials with superior properties. [1][2][3][4][5][6][7][8][9][10] Recent research has shed light on metallic glass thin films, [11][12][13][14][15][16][17][18][19][20][21] whose outstanding mechanical properties such as high fracture toughness, high yield strength, and high elastic limits are expected to improve the lifetime and reliability of devices. In addition, flexible formability of the metallic glass thin films under viscous flow conditions in the temperature range between glass transition and crystallization, called the super cooled liquid region (SCLR), enables the creation of structures never constructed using conventional microfabrication processes.…”

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confidence: 99%

Fe-B-Nd-Nb metallic glass thin films for microelectromechanical systems

Phan

Oguchi²,

Hara

et al. 2013

Applied Physics Letters

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In the present study, we investigate the mechanical properties, residual stress, and microprocessing compatibility of Fe67.5B22.5Nd6.3Nb3.7 metallic glass thin films (Fe-MGTFs). The mechanical properties are measured using a specially designed microtensile tester. The fracture toughness of the Fe-MGTF (6.36 MPa × m1/2) is more than twice that of Si, and the highest among the thin films developed for microelectromechanical systems (MEMS) to this point. In addition, the fabrication of freestanding microcantilevers illustrates the low residual stress and high microprocessing compatibility of Fe-MGTFs. The present study verifies the great potential of Fe-MGTFs for use in MEMS.

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mentioning

confidence: 99%

Fe-B-Nd-Nb metallic glass thin films for microelectromechanical systems

Phan

Oguchi²,

Hara

et al. 2013

Applied Physics Letters

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“…In general, since the displacement or sensitivity is proportional to the cube of the beam length, increasing the beam length is more advantageous with respect to to the sensitivity than a folded beam structure. (8)(9)(10)(11)(12)(13) However, owing to various constraints, folded-beam structures have been widely used in accelerometer design. For example, in the design of the mask, various parts should be densely arranged in a small area and folded-beam structures are easy to pack in a limited area.…”

Section: Introductionmentioning

confidence: 99%

Miniaturization of MEMS Capacitive Accelerometers Fabricated Using Silicon-on-insulator-MEMS Technology

2018

Sensors and Materials

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In our previous work, we studied capacitive micro-accelerometers fabricated using a simple silicon-on-insulator (SOI)-MEMS technology and the feasibility of an accelerometer with a beam length as long as the side length of the proof mass. In this work, we investigate the dependences of their sensitivities and resonant frequencies on the beam parameters and its configuration and study the method of designing the stuctures of capactive accelerometers with beam lengths as long as the side length of the proof mass in order to miniaturize the device.

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“…There have been many reports that study thermally induced deformation on traditional accelerometers including capacitive [13,14], resonant [15,16], and piezoelectric accelerometers [17,18], among others [19]. Their thermally induced deformation mainly stems from the temperature variation in their operating environments, or the contribution of their electric elements [20][21][22]. In contrast, the mechanism of the thermal effects of optomechanical accelerometers is very different from the traditional ones, which is attributed to the particular measuring principle.…”

Section: Introductionmentioning

confidence: 99%

Determination of thermally induced effects and design guidelines of optomechanical accelerometers

Bai

Wang

et al. 2017

Meas. Sci. Technol.

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Thermal effects, including thermally induced deformation and warm up time, are ubiquitous problems for sensors, especially for inertial measurement units such as accelerometers. Optomechanical accelerometers, which contain light sources that can be regarded as heat sources, involve a different thermal phenomenon in terms of their specific optical readout, and the phenomenon has not been investigated systematically. This paper proposes a model to evaluate the temperature difference, rise time and thermally induced deformation of optomechanical accelerometers, and then constructs design guidelines which can diminish these thermal effects without compromising other mechanical performances, based on the analysis of the interplay of thermal and mechanical performances. In the model, the irradiation of the micromachined structure of a laser source is considered a dominant factor. The experimental data obtained using a prototype of an optomechanical accelerometer approximately confirm the validity of the model for the rise time and response tendency. Moreover, design guidelines that adopt suspensions with a flat cross-section and a short length are demonstrated with reference to the analysis. The guidelines can reduce the thermally induced deformation and rise time or achieve higher mechanical performances with similar thermal effects, which paves the way for the design of temperature-tolerant and robust, high-performance devices.

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Thermal drift analysis using a multiphysics model of bulk silicon MEMS capacitive accelerometer

Cited by 70 publications

References 7 publications

Fe-B-Nd-Nb metallic glass thin films for microelectromechanical systems

Fe-B-Nd-Nb metallic glass thin films for microelectromechanical systems

Miniaturization of MEMS Capacitive Accelerometers Fabricated Using Silicon-on-insulator-MEMS Technology

Determination of thermally induced effects and design guidelines of optomechanical accelerometers

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