Thermal design of electric cabinet for high-resolution space camera

Li-heng, 陈立恒 Chen; Shuyan, 徐抒岩 Xu

doi:10.3788/ope.20111901.0069

Cited by 4 publications

(2 citation statements)

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“…Based on the results of thermal test and thermal analysis, Liheng Chen modified the thermal designby adding a heat pipe additionally [8].In this paper, research flow diagram of thermal analysis and design of control cabinet for pattern sewing machine was proposed according as figure 1.…”

Section: Research Processmentioning

confidence: 99%

Thermal Design and Thermal Analysis of Control Cabinet for Pattern Sewing Machine

Huang

2012

AMM

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Thermal design and thermal analysis of control cabinet for pattern sewing machine was researched to make components’ temperature meets the requirement. Basic flow sheet of research process was introduced. Then, preliminary thermal design and thermal analysis was performed, and the computed result indicated that temperature of some components was out of limit. Next, by optimizing the location of fan and components in cabinet, the temperature of servo driver 1 to 3 dropped 11.1 oC, 10.8 oC and 11.3 oC respectively. The data shows that cabinet’s heat dissipation is improved, and the thermal design of the cabinet is reasonable. Finally, Thermal test of the prototype was performed, which proves the thermal design is effective, and the numerical simulation result is correct.

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Section: Research Processmentioning

confidence: 99%

Thermal Design and Thermal Analysis of Control Cabinet for Pattern Sewing Machine

Huang

2012

AMM

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“…To solve this problem, References [1] and [6] have designed the traditional metal boss contact heat conduction of the top for the sensitive chip of the electric control box and electronic equipment, however, there is a lack of thermal conductivity design and simulation analysis of highly integrated controller PCB board for components with excessive heat dissipation, and the research object is only suitable for electronic equipment with heat dissipation mainly at the top and low heat flux density. Reference [2] on the cooling surface of thermal conductivity of different electronic components has taken a different way, and as a heat sink for electric cabinet shell outside the boundary conditions of thermal control are analyzed and discussed, but it lacks the highly concentrated heating components and the implementation of thermal conductivity of excessive heat flux density of the circuit board design, and lacks relevant research object the specific physical support validation. Reference [3], [4] and [5] find out the potential hot spots and weak links in heat resistance of the circuit board through thermal simulation analysis, and optimize the layout of the electronic components of the circuit board, but there is no specific design simulation demonstration of the interactive thermal conductivity through the structure and electronic.…”

Section: Introductionmentioning

confidence: 99%

Thermal conductivity design and verification of spaceborne remote sensing controller

Yu¹,

Li²,

Zhang³

2023

Ninth Symposium on Novel Photoelectronic Detection Technology and Applications

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With the continuous development of space technology, the assembly density of electronic components on the spaceborne remote sensing controller printed circuit board (PCB) is becoming higher and higher. And too much high-power electronic components working efficiently will be bound to produce more heat than their own limitation, only relying on the metal boss at the top of the electronic components to contact the cooling mode cannot timely export the working heat of the components, resulting in the damage of the components, so it is necessary to conduct heat efficiently. This paper focuses on the electronic components with high power consumption and high heat which are densely packed on the remote sensing controller board in high orbit, proposed an efficient heat dissipation method. By making use of the limited heat dissipation surface of the components to contact the heat conduction at the bottom and top of the components, the high heat generated by its work can be exported in time to ensure its stable operation. Finite element simulation is conducted to compare the influence between the method of this paper and the traditional thermal conductivity method on the heat dissipation function of components. According to the comparison results, the thermal conductivity method proposed in this paper is suitable for the thermal conductivity design of the spaceborne controller PCB board with too many high-power electronic components, and the rationality of this design is verified by thermal test. The results provide some guidance for the thermal conductivity design of high-power controllers with complex functions.

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Thermal analysis and design of the aerial camera’s primary optical system components

Liu

Ding

et al. 2012

Applied Thermal Engineering

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Thermal design of electric cabinet for high-resolution space camera

Cited by 4 publications

References 0 publications

Thermal Design and Thermal Analysis of Control Cabinet for Pattern Sewing Machine

Thermal Design and Thermal Analysis of Control Cabinet for Pattern Sewing Machine

Thermal conductivity design and verification of spaceborne remote sensing controller

Thermal analysis and design of the aerial camera’s primary optical system components

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