Thermal Design of a Spray-Based Heat Sink Integrated With a Compact Vapor Compression Cooling System for Removal of High Heat Fluxes

Oliveira, Pablo A. de; Barbosa, Jader R.

doi:10.1080/01457632.2015.994918

Cited by 4 publications

(3 citation statements)

References 40 publications

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“…Another field in miniature/compact vapour-compression system is also spray cooling, where most recent analysis of such systems were performed by Oliveira and Barbosa [29], Carneiro and Barbosa [30] and Carneiro et al [31].…”

Section: Micro Vapour-compression In Other Applicationsmentioning

confidence: 99%

State of the art of micro vapour-compression systems

Blatnik,

Klinar,

Kitanovski

2024

J. Phys.: Conf. Ser.

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Thermal management is becoming more challenging due to the increasing compactness and computational power of appliances. Affordable and efficient solutions include active liquid cooling methods, thermoelectric cooling, and the use of heat pipes. From these, vapour-compression technologies achieve the highest power density. However, the downscaling of vapour-compression for cooling of personal computers or workstations is rather problematic from several different reasons. The first problem concerns the low second law efficiency of miniature vapour-compression systems. The second problem concerns the available space occupation of such a cooling system. Moreover, miniature and high-power density condensers and evaporators have not yet been adequately researched and developed to date. In this review, we present several vapour-compression refrigeration systems that are based in some way on the miniaturisation of systems or individual components – evaporators, condensers, and compressors. These are presented and compared in terms of cooling power, COP, and the second law efficiency. At the end of the manuscript, guidelines for future improvements and the implementation of miniature vapour-compression systems are presented.

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Section: Micro Vapour-compression In Other Applicationsmentioning

confidence: 99%

State of the art of micro vapour-compression systems

Blatnik,

Klinar,

Kitanovski

2024

J. Phys.: Conf. Ser.

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“…systems such as laser power supplies and their optical systems. They are able to extract heat flux densities exceeding 1000 W/cm 2 while keeping microchips at temperatures below 65°C [39][40][41][42][43][44].…”

Section: Refrigerated Heat Exchangersmentioning

confidence: 99%

“…These systems must therefore meet an important challenge: the miniaturization required by designs favoring small sizes [21,42,43].…”

Section: Refrigerated Heat Exchangersmentioning

confidence: 99%

Heat Exchangers for Electronic Equipment Cooling

Benallou¹

2022

Heat Exchangers

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Recent developments in the electronic equipment market have been very demanding on two important design parameters: the size of the equipment and the efficiency of the cooling system. Indeed, the race for more applications handling in reduced sizes in the case of smartphones requires the use of important amounts of energy in tiny volumes. Similar constraints are encountered in the design of the new generation of vehicles (electric cars, hybrid vehicles, high-speed trains, airplanes), which impose the use of highly integrated electronic structures, resulting in significant power densifications (up to several hundred Watts/cm2). In some CPU boards, the power generated per unit chip area is in the order of 500 kW/m2. Cooling of such boards requires low volume and lightweight heat exchangers to transfer tremendous amounts of heat. The same situation is encountered for most newly developed demotics’ equipment. This chapter reviews available state-of-the-art technologies for electronic equipment cooling, including passive and active techniques, as well as one and two-phase heat exchange. Directions for the design of the different heat exchangers will also be given.

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Development and analysis of a simple structured and economic miniature vapor compression refrigerator for cooling electronics in harsh environment

Zhou

2023

Applied Thermal Engineering

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Thermal Design of a Spray-Based Heat Sink Integrated With a Compact Vapor Compression Cooling System for Removal of High Heat Fluxes

Cited by 4 publications

References 40 publications

State of the art of micro vapour-compression systems

State of the art of micro vapour-compression systems

Heat Exchangers for Electronic Equipment Cooling

Development and analysis of a simple structured and economic miniature vapor compression refrigerator for cooling electronics in harsh environment

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