Thermal design and testing of CCD for space camera

Li-heng, 陈立恒 Chen; Yan-chun, 李延春 Li; Zhi-tao, 罗志涛 Luo; Jihong, 董吉洪 Dong; Zhong-su, 王忠素 Wang; Shuyan, 徐抒岩 Xu

doi:10.3788/ope.20111909.2117

Cited by 9 publications

(3 citation statements)

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“…The experimental results for dry finishing are obtained from the central composite design which is made of three kinds of experimental points which are factorial points, axial points and center points. The central composite design (CCD)is capable of fitting up to the second order including the quadratic terms, which can fit the following model [9]：…”

Section: Experimental Set-up and Proceduresmentioning

confidence: 99%

Empirical Modeling of High-Speed WEDM Finishing in Gas

Wang

et al. 2012

AMR

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This paper aims at getting the finishing process models in HS-WEDM in gas. Using cutting speed and the roughnessRaas index, the five factors of pulse-on time, peak current, offset, pulse interval ratio and worktable feed were chosen in dry finishing. The effects of the five factors and their interaction on cutting speed and the Surface roughnessRaand empirical models for cutting speed and roughnessRawere developed by performing a designed experiment based on the central composite design (CCD) experiments, significant order influencing cutting speed and roughness were found. The results of the verification test show thatRaRegression Model and Cutting Speed Regression Model have high reliability, and can achieve significant prediction effect, more accurate mathematical models are provided for the further HS-WEDM process research.

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Section: Experimental Set-up and Proceduresmentioning

confidence: 99%

Empirical Modeling of High-Speed WEDM Finishing in Gas

Wang

et al. 2012

AMR

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“…To solve this problem, References [1] and [6] have designed the traditional metal boss contact heat conduction of the top for the sensitive chip of the electric control box and electronic equipment, however, there is a lack of thermal conductivity design and simulation analysis of highly integrated controller PCB board for components with excessive heat dissipation, and the research object is only suitable for electronic equipment with heat dissipation mainly at the top and low heat flux density. Reference [2] on the cooling surface of thermal conductivity of different electronic components has taken a different way, and as a heat sink for electric cabinet shell outside the boundary conditions of thermal control are analyzed and discussed, but it lacks the highly concentrated heating components and the implementation of thermal conductivity of excessive heat flux density of the circuit board design, and lacks relevant research object the specific physical support validation.…”

Section: Introductionmentioning

confidence: 99%

Thermal conductivity design and verification of spaceborne remote sensing controller

Yu¹,

Li²,

Zhang³

2023

Ninth Symposium on Novel Photoelectronic Detection Technology and Applications

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With the continuous development of space technology, the assembly density of electronic components on the spaceborne remote sensing controller printed circuit board (PCB) is becoming higher and higher. And too much high-power electronic components working efficiently will be bound to produce more heat than their own limitation, only relying on the metal boss at the top of the electronic components to contact the cooling mode cannot timely export the working heat of the components, resulting in the damage of the components, so it is necessary to conduct heat efficiently. This paper focuses on the electronic components with high power consumption and high heat which are densely packed on the remote sensing controller board in high orbit, proposed an efficient heat dissipation method. By making use of the limited heat dissipation surface of the components to contact the heat conduction at the bottom and top of the components, the high heat generated by its work can be exported in time to ensure its stable operation. Finite element simulation is conducted to compare the influence between the method of this paper and the traditional thermal conductivity method on the heat dissipation function of components. According to the comparison results, the thermal conductivity method proposed in this paper is suitable for the thermal conductivity design of the spaceborne controller PCB board with too many high-power electronic components, and the rationality of this design is verified by thermal test. The results provide some guidance for the thermal conductivity design of high-power controllers with complex functions.

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“…Compared with the organic substrate, the copper substrate has high thermal conductivity, high mechanical strength, good processing performance, and has been widely used in military and aerospace fields [4][5][6]. Due to the high thermal resistance when directly installing the copper substrate and casing, thermal interface materials (e.g., thermally conductive gel) are usually applied between the copper substrate and casing to reduce the interfacial thermal resistance [7,8]. At present, more researches on the copper substrate focus on processing methods [9,10], etc., and there are few studies on the failure of copper substrates used in electronic equipment.…”

Section: Introductionmentioning

confidence: 99%

Failure analysis of copper substrate crack in high-voltage power supply

Liu,

2023

J. Phys.: Conf. Ser.

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Aiming at the crack phenomenon of a copper substrate circuit in a high-voltage power supply, the slice analysis was carried out and showed that the crack part was the dielectric layer of the copper substrate. The finite element analysis is used to study the reason for dielectric layer cracking and discuss the improvement measures from the thickness of thermal conductive gel and the layout of components. The simulations results show that the reason for dielectric layer cracking is that the surface-mounted device (SMD) is too close to the mounting hole when the copper substrate bottom is coated with thermal conductive gel, reducing the thickness of thermal conductive gel or keeping the SMD away from the mounting holes can avoid the dielectric layer cracking, but it is easier to change the location of SMD.

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Thermal design and testing of CCD for space camera

Cited by 9 publications

References 0 publications

Empirical Modeling of High-Speed WEDM Finishing in Gas

Empirical Modeling of High-Speed WEDM Finishing in Gas

Thermal conductivity design and verification of spaceborne remote sensing controller

Failure analysis of copper substrate crack in high-voltage power supply

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