Thermal design and analysis of multi-chip LED module with ceramic substrate

Yin, Luqiao; Yang, Lianqiao; Yang, Wade; Guo, Yansheng; Ma, Kaisheng; Li, Shuzhi; Zhang, Jianhua

doi:10.1016/j.sse.2010.06.028

Cited by 75 publications

(22 citation statements)

References 17 publications

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“…[ [1][2][3][4][5] 고출력 반도체 광원의 방열특성을 개선하기 위해, 전도성 기판 위에 소자를 수직구조로 설계하는 방법 [4] 과, 각 층의 열 저항을 최소화하는 구조의 패키지 설계 방법 [5] 이 복합적으로 사용 되고 있다. 수직구조로 설계된 광소자의 발열부에서는 …”

Section: 서 론unclassified

Heat Conduction Analysis and Improvement of a High-Power Optical Semiconductor Source Using Graphene Layers

O†²

2015

Korean Journal of Optics and Photonics

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The heat flow characteristics of a high-power optical semiconductor source have been analyzed using a 3D CFD commercial tool, and the thermal resistance values for each of the layers revealed the places for thermal bottlenecks to be improved. As the heat source of a LD (Laser Diode) has a small volume and a narrow surface, the effective thermal cross-sectional area near it is also quite small. It was possible to expand the cross-sectional area effectively by using graphene layers on the TIM (Thermal Interface Material) layers of a LD chip. The effective values of heat resistance for the layers are compared to confirm the improvement effect of the graphene layers before and after, which can be considered to expand the thermal cross section of the heat transfer path.

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Section: 서 론unclassified

Heat Conduction Analysis and Improvement of a High-Power Optical Semiconductor Source Using Graphene Layers

O†²

2015

Korean Journal of Optics and Photonics

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“…Horng [16] and Lion [17] improve the thermal performance by changing the die bonding material. The materials of substrates [18,19] and heat sinks [20] can also be changed to improve the thermal management at the board and system levels. However, the interface material between the LED array and heat sink is rarely studied.…”

Section: Introductionmentioning

confidence: 99%

Thermal analysis of COB array soldered on heat sink

Chen

Liu

et al. 2014

International Communications in Heat and Mass Transfer

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“…A better package structure is urgently needed to solve the thermal cooling issue. Manufacturing the multi-chip LED module by directly attaching the LED chips onto substrate or slug has become the latest research direction [4,5]. Through this method, the thermal resistance of heat dissipation path is greatly reduced and the manufacturing process is also simplified.…”

Section: Introductionmentioning

confidence: 99%

Development of a new die-attach process and related bonding tool for multi-chip LED module

Hang

Wang

Fei

et al. 2012

2012 13th International Conference on Electronic Packaging Technology &Amp; High Density Packaging

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A new die-attach process was presented for the multi chip LED module, and the related bonding tool for the LED module was also designed. With the new bonding process and the novel bonding tool, 21 LED chips have been attached onto a single substrate within one bonding process. The investigation of bonding chips' appearance and thickness of interface layer were carried out to evaluate the die-attach performance. The die-attach process has been optimized by studying the effects of bonding force on the die-attach performance. The results showed this method can provide a high die-attach precision as well as the chip attachment consistency.

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Thermal design and analysis of multi-chip LED module with ceramic substrate

Cited by 75 publications

References 17 publications

Heat Conduction Analysis and Improvement of a High-Power Optical Semiconductor Source Using Graphene Layers

Heat Conduction Analysis and Improvement of a High-Power Optical Semiconductor Source Using Graphene Layers

Thermal analysis of COB array soldered on heat sink

Development of a new die-attach process and related bonding tool for multi-chip LED module

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