Thermal decomposition temperature-dependent bonding performance of Ag nanostructures derived from metal–organic decomposition
Chuncheng Wang,
Hiroaki Tatsumi,
Hiroshi Nishikawa
Abstract:In wide-bandgap semiconductor power device packaging, die bonding refers to attaching the die to substrate. Thereby, the process temperature of Ag sintering for the die bonding should be low to prevent damage to fragile dies. Herein, an organic-free strategy using Ag nanostructures derived from the thermal decomposition of metal–organic decomposition (MOD) was proposed to achieve low-temperature bonding. Significant effects on bonding performance were determined by the thermal decomposition temperature, which … Show more
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