Thermal cycling reliability analysis of an anisotropic conductive adhesive attached large-area chip with area array configuration

Abstract

The reliability of adhesive flip chip attachments was studied. A large-area chip with a great number of contacts was attached onto a flexible polyimide substrate using anisotropic conductive adhesive film (ACF). The test samples were manufactured using various bonding forces and the reliability of the assemblies was examined using a thermal cycling test. Two temperature change rates were used in the cycling test to study the effect of the change rate on the observed failure times and modes. The results show that the ACF flip chip attachment of large-area chips with matrix array interconnections is an applicable technique. Furthermore, a significant increase in the reliability of the assemblies was obtained by increasing the bonding force. However, early failures were observed in all the samples, especially in the outermost adhesive interconnections. Failure analysis performed on the samples exhibiting early failures showed signs of adhesive delamination and silicon chip cracking. No clear differences in the results between the two temperature cycling tests used were observed. However, the faster temperature change rate seemed to cause a higher number of early failures.

Enabling Low Pressure, Low Temperature, and Particle Control for Anisotropic Conductive Adhesives

“…[1,2] Previous reliability studies of ACA interconnects have shown failures that typically stem from its thermo-mechanical performance rather than the conductive particles. [28][29][30] Hence, electrical resistance has been the main focus of this work, offering the possibility of controlling the conductive particles in ACA interconnects. Further investigation into the reliability of the proposed ACA interconnection approach, however, is crucial to understand the interconnect robustness under operating conditions.…”