Thermal Cycling Performance of Heterogeneous Solder Ball Joints with Sn-3.0Ag-0.5Cu and Sn-0.75Cu(-Ni,Bi) Solder Ball Composition for BGA Package
Joo Young Bae,
Mi-Song Kim,
So-Hee Hyun
et al.
Abstract:Sn-3.0Ag-0.5Cu (SAC305) is one of the most commonly used Pb-free solder composition nowadays. A minor alloying element addition can improve mechanical properties and thermal reliability of the solder joint. Minor amount of Bithmuth (Bi) or Nickel (Ni) addition can improve mechanical properties of solder by solid solution strengthening, or ensure the structural stability of the intermetalllic compounds. Also, low melting temperature solder with Bithmuth can reduce the cost of soldering process and keep componen… Show more
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