Thermal Cycling and General Reliability Considerations

Serebreni, Maxim

doi:10.1002/9781119482093.ch11

Cited by 1 publication

(1 citation statement)

References 28 publications

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“…Therefore, a large number of studies have been conducted on heat transfer for electronic cooling. Maxim (Serebreni, 2020) presented that 55% of the solder joint failures are attributable to the high temperatures and temperatures cycling. Under these two conditions, the accumulation of shear stress will lead to fatigue on the solder joints.…”

Section: Introductionmentioning

confidence: 99%

Optimization of flexible printed circuit board’s cooling with air flow and thermal effects using response surface methodology

Lim

Abdullah

Aziz

et al. 2021

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Purpose This study aims to investigate the interaction of independent variables [Reynolds number (Re), thermal power and the number of ball grid array (BGA) packages] and the relation of the variables with the responses [Nusselt number ((Nu) ¯ ), deflection/FPCB’s length (d/L) and von Mises stress]. The airflow and thermal effects were considered for optimizing the Re of various numbers of BGA packages with thermal power attached on flexible printed circuit board (FPCB) for optimum cooling performance with least deflection and stress by using the response surface method (RSM). Design/methodology/approach Flow and thermal effects on FPCB with heat source generated in the BGA packages have been examined in the simulation. The interactive relationship between factors (i.e. Re, thermal power and number of BGA packages) and responses (i.e. deflection over FPCB length ratio, stress and average Nusselt number) were analysed using analysis of variance. RSM was used to optimize the Re for the different number of BGA packages attached to the FPCB. Findings It is important to understand the behaviour of FPCB when exposed to both flow and thermal effects simultaneously under the operating conditions. Maximum d/L and von Misses stress were significantly affected by all parametric factors whilst (Nu)¯ is significantly affected by Re and thermal power. Optimized Re for 1–3 BGA packages with maximum thermal power applied has been identified as 21,364, 23,858 and 29,367, respectively. Practical implications This analysis offers a better interpretation of the parameter control in FPCB with optimized Re for the use of force convection electronic cooling. Optimal Re could be used as a reference in the thermal management aspect in designing the BGA package. Originality/value This research presents the parameters’ effects on the reliability and heat transfer in FPCB design. It also presents a method to optimize Re for the different number of BGA packages attached to increase the reliability in FPCB’s design.

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Section: Introductionmentioning

confidence: 99%