Thermal cycling aging effects on the tensile property and constitute behavior of Sn–3.0Ag–0.5Cu solder alloy

Interfacial reaction of Sn-1.5Ag-2.0Zn low-silver lead-free solder with oriented copper

“…However, the solder has a high melting point and is costly [ [11] , [12] , [13] , [14] ]. Many studies have been conducted to improve the wettability and reduce the melting point by adding Cu, Zn, Ni, Bi and other components to Sn–Ag solder [ [15] , [16] , [17] , [18] , [19] , [20] ]. Sn-3.5Ag is the most commonly used lead-free solder with high Ag content and high cost.…”