Abstract:The continued desire to utilize an alternative to lead-based solder materials for electrical interconnections has led to significant research interest in Anisotropic Conductive Adhesives (ACAs). The use of ACAs in electrical connections creates bonds using a combination of metal particles and epoxies to replace solder. The novel ACA discussed in this paper allows for bonds to be created through aligning columns of conductive particles along the Z-axis. These columns are formed by the application of a magnetic … Show more
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