Thermal conductivity of transparent and flexible polymers containing fillers: A literature review

Ngo, Ich-Long; Jeon, Sang-Woo

doi:10.1016/j.ijheatmasstransfer.2016.02.082

Cited by 193 publications

(108 citation statements)

References 97 publications

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“…DSC analysis proved the presence of phase transition located at 38.3 and 39.7 °C for H B and H NT (Figure S3, Supporting Information), respectively, related to the conformation changes of the protein chains upon the increase of the temperature . In the H NT case, a shift of the volume phase transition at higher temperature was recorded as a consequence of the different mechanical and thermal properties of H NT samples …”

Section: Resultsmentioning

confidence: 88%

“…At 0 V, H NT showed higher thermoresponsivity than H B (

W_{0}^{T, V}

of 4.50 and 1.26, respectively) as a consequence of the presence of MWNT_COOH acting as a thermoconducting element enhancing the sensitivity to the temperature increase . Furthermore, the WR(%) recorded at 25 °C is higher in H NT than H B case, since MWNT_COOH allow an easy diffusion of water molecules in the hydrogel network.…”

Section: Resultsmentioning

confidence: 99%

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Dual Stimuli Responsive Gelatin‐CNT Hybrid Films as a Versatile Tool for the Delivery of Anionic Drugs

Cirillo

Curcio

Vittorio

et al. 2016

Macro Materials & Eng

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Hybrid hydrogel films able to modulate the release of anionic species, ketoprofen (Ket) and bovine serum albumin (BSA), as a function of their molecular size are prepared by UV‐induced polymerization of methacrylated gelatin in the presence of oxidized multiwalled carbon nanotubes (MWNT_COOH). The dual‐stimuli responsive composites can modulate the release in response to the variation of temperature and the application of an external voltage. Drug release profiles, analyzed by mathematical models, show that different temperatures (25 and 45 °C) and applied voltages (0 and 36 V) have a different effect on the release of the two therapeutics. Ket release is enhanced at 45 °C (77% vs 22% at 25 °C) with the maximum value recorded when 36 V is applied (94%). An increase in the amount of released BSA is recorded at 45 °C (96% vs 50% at 25 °C), while the application of the external voltage reduces this value (39%).

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Section: Resultsmentioning

confidence: 88%

“…At 0 V, H NT showed higher thermoresponsivity than H B (

W_{0}^{T, V}

Section: Resultsmentioning

confidence: 99%

Dual Stimuli Responsive Gelatin‐CNT Hybrid Films as a Versatile Tool for the Delivery of Anionic Drugs

Cirillo

Curcio

Vittorio

et al. 2016

Macro Materials & Eng

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“…Thus, conventional heat sinks are not suitable for bendable LED arrays. Polymer composites containing highly conductive fillers, such as carbon nanotubes, graphite, carbon black, metallic or ceramic powder, 23,24 are promising materials for heat dissipation in bendable LED arrays, as these composites have higher thermal conductivity than their pure base polymers and better flexibility than metals or ceramics. A three-dimensional steadystate model was established for analyzing the effects of both factors on heat flux and temperature distribution in bendable LED arrays.…”

Section: A Heat Dissipation Modelmentioning

confidence: 99%

Heat dissipation analysis of bendable AlGaInP micro-LED arrays

et al. 2017

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A strategy for fabricating bendable AlGaInP light emitting diode (LED) arrays is presented in this paper. Sample LED arrays with 8 × 8 pixels were fabricated and subjected to bending. Bending only weakly affected the light output power and the current–voltage characteristics of the arrays. LED arrays suffer from a thermal problem owing to the energy loss during the electrical-to-optical energy conversion. We have designed a three-dimensional heat conduction model for analyzing the effect of the polymer substrate, the configuration of pixels, and the micro-structure on heat dissipation in bendable LED arrays. Thermal conductivity of the polymer substrate critically affected the heat dissipation, suggesting that the substrate thickness should be in the 500–1000 μm range. A larger pixel distance yielded more distributed heat sources and more uniform temperature distribution. Micro-structured polymer substrates yielded lower temperature, especially for the fins array micro-structure. Based on enhancing the polymer’s thermal conductivity and distributing LED pixels, optimizing the substrate’s micro-structure is an effective method to improve heat dissipation in bendable LED arrays. Optimized heat dissipation could effectively reduce heat accumulation in LED arrays and alleviate an increase in the junction temperature, allowing to increase the output power of the device.

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“…However, these conventional thermal interface materials (TIMs) are limited by relatively low thermal conductivity and high loading ratios (>30 vol%) in order to form a complete heat transfer path in an epoxy matrix. [8] Recently, Huang et al prepared silicon carbide (SiC) NWs/epoxy resin nanocomposites using a bar-coating method and achieved high in-plane thermal conductivity (10.10 W m −1 K −1 ) at a very low filler loading (5 wt%). Currently, one of the most promising solutions is to replace traditional fillers with 1D nanofillers such as nanowires (NWs), nanotubes, nanofibers, and nanorods, [5] due to their high aspect ratio, low permeation threshold, and low doping level.…”

Section: Introductionmentioning

confidence: 99%

Tailoring Highly Thermal Conductive Properties of Te/MoS₂/Ag Heterostructure Nanocomposites Using a Bottom‐Up Approach

Yan

et al. 2018

Adv Elect Materials

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Ever‐increasing packaging and power densities of modern electronic devices in the present “More‐than‐Moore” technology era demand higher performance thermal interface materials (TIMs). However, conventional composite TIMs require higher loading to achieve better thermal conductive property, resulting in a mechanical problem. The poor wetting property of matrix loading materials further increases the interfacial thermal resistance (ITR). In this work, a one‐step hydrothermal method is employed to grow 2D molybdenum disulfide (MoS2) nanosheets on a tellurium (Te) nanowire skeleton and silver (Ag) nanoparticles are further decorated on MoS2 nanosheets via the photoreduction method. The in‐plane thermal conductivity of the final nanocomposite reaches as high as 10.4 W m−1 K−1, which is 4,160% higher than that of a pure epoxy resin and one order of magnitude higher than that of conventional polymeric nanocomposites. The 3D interconnected heat transferring network of Te/MoS2/Ag greatly enhances the thermal stability of the composite in practical applications. The rational materials design concept may contribute to the development of new types of high‐performance thermal management materials.

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Thermal conductivity of transparent and flexible polymers containing fillers: A literature review

Cited by 193 publications

References 97 publications

Dual Stimuli Responsive Gelatin‐CNT Hybrid Films as a Versatile Tool for the Delivery of Anionic Drugs

Dual Stimuli Responsive Gelatin‐CNT Hybrid Films as a Versatile Tool for the Delivery of Anionic Drugs

Heat dissipation analysis of bendable AlGaInP micro-LED arrays

Tailoring Highly Thermal Conductive Properties of Te/MoS₂/Ag Heterostructure Nanocomposites Using a Bottom‐Up Approach

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Thermal conductivity of transparent and flexible polymers containing fillers: A literature review

Cited by 193 publications

References 97 publications

Dual Stimuli Responsive Gelatin‐CNT Hybrid Films as a Versatile Tool for the Delivery of Anionic Drugs

Dual Stimuli Responsive Gelatin‐CNT Hybrid Films as a Versatile Tool for the Delivery of Anionic Drugs

Heat dissipation analysis of bendable AlGaInP micro-LED arrays

Tailoring Highly Thermal Conductive Properties of Te/MoS2/Ag Heterostructure Nanocomposites Using a Bottom‐Up Approach

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Product

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About

Tailoring Highly Thermal Conductive Properties of Te/MoS₂/Ag Heterostructure Nanocomposites Using a Bottom‐Up Approach