Thermal conductivity of molding compounds for plastic packaging

Abstract

Abstruct-Alumina-loaded new molding compounds feature a thermal conductivity up to 4.5 W h K , a water uptake smaller than 0.2 weight %, a coefficient of thermal expansion of 10 ppm/K, and an excellent popcorn resistance (0 cracks from 6). The thermal conductivity of such particulate-loaded polymers has been investigated as a function of the volume content (0430%) of aluminum oxide, quartz, and fused quartz. The thermal expansion and the specific heat have also been recorded. A new model allows one to calculate the thermal conductivity and the thermal expansion within a couple percent.

Thermal properties of low loss PTFE‐CeO2 dielectric ceramic composites for microwave substrate applications

“…Unfortunately, polymeric materials are inherently poor thermal conductors, and they must be modified to assist in heat removal from electronics. 3,4 Fillers play an important role in the production of polymeric materials. In addition to cost saving, other value-added properties are gained through the use of fillers.…”

Effect of amounts and types of silicon nitride on thermal conductivity of Si₃N₄/epoxy resin composite

“…Similar results were also reported in other filler-material/epoxy composites, including alumina, silica, and aluminum nitride. 22)24) For example, Bujard et al reported an alumina/epoxy resin composite with 50 vol.% alumina content with thermal conductivity of around 1.5 W/(m·K), 22) while Hsieh et al reported a AlN/epoxy composite at 45 vol.% of AlN content with a thermal conductivity of around 1.3 W/(m·K). 25) Differences in thermal conductivity were clearly observed in the region above 50 vol.% (2nd region).…”

Preparation and properties of Si3N4/PS composites used for electronic packaging

“…Since the inorganic ceramic has a high thermal conductivity (>150 W/m K, AlN, Si 3 N 4 [9,10]), a thermally conductive composite can be manufactured by addition of ceramic fillers to the polymer, as early proposed by Bolt [11,12]. In the literature, a lot of composite systems have been investigated including different kinds of fillers (diamond [3], AlN [4,7], SiO 2 [3,13], Al 2 O 3 [14], SiC [7,15], BN [16]) and polymer resins (epoxy [4,6,13], polyvinylidene fluoride [7], polystyrene [17,18] example). The main emphasis has been placed on considering the effect of polymer type, filler category, volume fraction, configuration and treatment of the filler.…”