Thermal conductivity of metal matrix composites with coated inclusions: A new modelling approach for interface engineering design in thermal management

Molina-Jordá, J.M.

doi:10.1016/j.jallcom.2018.02.092

Cited by 16 publications

(3 citation statements)

References 19 publications

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“…The preferred alternative for diamond/Al composite interface layers is a nanoscale coating layer with high sound velocities, such as Ti, Cr, and other metals [26]. With the increase in coating thickness, the tensile, compressive, and bending strength of diamond/Al composites gradually increase [4], but the TC of the composite increases first and then decreases [27]. On the premise of improving the interface bonding, the coating thickness should be as low as possible to reduce the interface thermal resistance [24].…”

Section: Methodsmentioning

confidence: 99%

Improved Bending Strength and Thermal Conductivity of Diamond/Al Composites with Ti Coating Fabricated by Liquid–Solid Separation Method

Zhou,

Jia,

Sun

et al. 2024

Materials

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In response to the rapid development of high-performance electronic devices, diamond/Al composites with high thermal conductivity (TC) have been considered as the latest generation of thermal management materials. This study involved the fabrication of diamond/Al composites reinforced with Ti-coated diamond particles using a liquid–solid separation (LSS) method. The interfacial characteristics of composites both without and with Ti coatings were evaluated using SEM, XRD, and EMPA. The results show that the LSS technology can fabricate diamond/Al composites without Al4C3, hence guaranteeing excellent mechanical and thermophysical properties. The higher TC of the diamond/Al composite with a Ti coating was attributed to the favorable metallurgical bonding interface compounds. Due to the non-wettability between diamond and Al, the TC of uncoated diamond particle-reinforced composites was only 149 W/m·K. The TC of Ti-coated composites increased by 85.9% to 277 W/m·K. A simultaneous comparison and analysis were performed on the features of composites reinforced by Ti and Cr coatings. The results suggest that the application of the Ti coating increases the bending strength of the composite, while the Cr coating enhances the TC of the composite. We calculate the theoretical TC of the diamond/Al composite by using the differential effective medium (DEM) and Maxwell prediction model and analyze the effect of Ti coating on the TC of the composite.

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Section: Methodsmentioning

confidence: 99%

Improved Bending Strength and Thermal Conductivity of Diamond/Al Composites with Ti Coating Fabricated by Liquid–Solid Separation Method

Zhou,

Jia,

Sun

et al. 2024

Materials

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“…Diamond/aluminum composites, regarded for their unique properties such as high thermal conductivity [4][5][6] and an adjustable coefficient of thermal expansion [7,8], have found applications in thermal management materials for electronic packaging. The diamond/aluminum interface, as a nonmetal/metal interface, is highly non-wetting and acoustically mismatched [9,10], so the performance of the composite is determined by the interface between diamond and aluminum. Additionally, Al 4 C 3 , a brittle and easily hydrolyzed interfacial product, is prone to be formed in the preparation process of diamond/aluminum composites [11][12][13][14].…”

Section: Introductionmentioning

confidence: 99%

Effects of the In Situ Growth of CNTs on Ti-Coated Diamond Surfaces on the Mechanical Properties of Diamond/Aluminum Composites

Wu,

Zhu,

Xia

et al. 2024

Nanomaterials

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Diamond/aluminum composites have attracted significant attention as novel thermal management materials, with their interfacial bonding state and configuration playing a crucial role in determining their thermal conductivity and mechanical properties. The present work aims to evaluate the bending strength and thermal conductivity of CNT-modified Ti-coated diamond/aluminum composites with multi-scale structures. The Fe catalyst was encapsulated on the surface of Ti-coated diamond particles using the solution impregnation method, and CNTs were grown in situ on the surface of Ti-coated diamond particles using the plasma-enhanced chemical vapor deposition (PECVD) method. We investigated the influence of interface structure on the thermal conductivity and mechanical properties of diamond/aluminum composites. The results show that the CNT-modified Ti-coated diamond/aluminum composite exhibits excellent bending strength, reaching up to 281 MPa, compared to uncoated diamond/aluminum composites and Ti-coated diamond/aluminum composites. The selective bonding between diamond and aluminum was improved by the interfacial reaction between Ti and diamond particles, as well as between CNT and Al. This led to the enhanced mechanical properties of Ti-coated diamond/aluminum composites while maintaining acceptable thermal conductivity. This work provides insights into the interface’s configuration design and the performance optimization of diamond/metal composites for thermal management.

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“…The other involved the formation of a nanosized titanium layer on the surfaces of the diamond particles, which can form carbide with diamond and diffusion with copper at elevated sintering temperatures. Thus, the Ti coatings on the diamond surface can improve the wettabilities between diamond and liquid copper efficiently [17][18][19][20]. Additionally, it can also protect the diamond powder from the atmosphere and reduce the degree of graphitization at high temperatures [12].…”

Section: Introductionmentioning

confidence: 99%

The Interface and Fabrication Process of Diamond/Cu Composites with Nanocoated Diamond for Heat Sink Applications

Zhou

et al. 2021

Metals

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The coefficients of thermal expansion (CTE) and thermal conductivity (TC) are important for heat sink applications, as they can minimize stress between heat sink substrates and chips and prevent failure from thermal accumulation in electronics. We investigated the interface behavior and manufacturing of diamond/Cu composites and found that they have much lower TCs than copper due to their low densities. Most defects, such as cavities, form around diamond particles, substantially decreasing the high TC of diamond reinforcements. However, the measurement results for the Cu-coated diamond/Cu composites are unsatisfactory because the nanosized copper layer on the diamond surface grew and spheroidized at elevated sintering temperatures. Realizing ideal interfacial bonding between a copper matrix and diamond particles is difficult. The TC of the 40 vol.% Ti-coated diamond/Cu composite is 475.01 W m−1 K−1, much higher than that of diamond/Cu and Cu-coated diamond/Cu composites under equivalent manufacturing conditions. The minimally grown titanium layer retained its nanosized and was consistent with the sintering temperature. Depositing a nanosized titanium layer on a diamond surface will strengthen interfacial bonding through interface reactions among the copper matrix, nanosized titanium layer and diamond particles, reducing the interfacial thermal resistance and exploiting the high TC of diamond particles, even if defects from powder metallurgy remain. These results provide an important experimental and theoretical basis for manufacturing diamond/Cu composites for heat sink applications.

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Thermal conductivity of metal matrix composites with coated inclusions: A new modelling approach for interface engineering design in thermal management

Abstract: Please cite this article as: J.M. Molina-Jordá, Thermal conductivity of metal matrix composites with coated inclusions: A new modelling approach for interface engineering design in thermal management,

Cited by 16 publications

References 19 publications

Improved Bending Strength and Thermal Conductivity of Diamond/Al Composites with Ti Coating Fabricated by Liquid–Solid Separation Method

Improved Bending Strength and Thermal Conductivity of Diamond/Al Composites with Ti Coating Fabricated by Liquid–Solid Separation Method

Effects of the In Situ Growth of CNTs on Ti-Coated Diamond Surfaces on the Mechanical Properties of Diamond/Aluminum Composites

The Interface and Fabrication Process of Diamond/Cu Composites with Nanocoated Diamond for Heat Sink Applications

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