Thermal conductivity of epoxy adhesives filled with silver particles

Bjorneklett, A.; Halbo, Leif; Kristiansen, Helge

doi:10.1016/0143-7496(92)90030-y

Cited by 70 publications

(33 citation statements)

References 6 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…6. The total bond area for the test structure was estimated to be approximately 1.05 mm 2 . This represents only approximately 9% of the chip area, which is very small, and thereby increases stresses in the bonds during the environmental testing.…”

Section: Stencil Printing Of the Adhesivementioning

confidence: 99%

“…Given the traditional flake-like conductive particles, the percolation threshold will also depend on the orientation of the flakes. In a typical microelectronic application, both the application of the adhesive and the shear applied during placement of the component cause a significant orientation of the flakes, 2 as illustrated in Fig. 1.…”

Section: Introduction 1conductive Adhesivesmentioning

confidence: 99%

See 1 more Smart Citation

Use of conductive adhesive for MEMS interconnection in ammunition fuze applications

Gakkestad

Dalsjo

Kristiansen

et al. 2010

J. Micro/Nanolith. MEMS MOEMS

View full text Add to dashboard Cite

Abstract.A novel conductive adhesive is used to interconnect MEMS test structures with different pad sizes directly to a printed circuit board (PCB) in a medium caliber ammunition fuze. The fuze environment is very demanding, with a setback acceleration exceeding 60,000 g and a centripetal acceleration increasing radially with 9000 g/mm. The adhesive shows excellent mechanical and thermal properties. The mounted MEMS test structures perform well when subjected to rapid temperature cycling according to military-standard 883G method 1010.8 test condition B. The test structures pass 100 temperature cycles, followed by a firing test where the test structures are exposed to an acceleration of more than 60,000 g. C 2010 Society of Photo-Optical Instrumentation Engineers.

show abstract

Section: Stencil Printing Of the Adhesivementioning

confidence: 99%

Section: Introduction 1conductive Adhesivesmentioning

confidence: 99%

Use of conductive adhesive for MEMS interconnection in ammunition fuze applications

Gakkestad

Dalsjo

Kristiansen

et al. 2010

J. Micro/Nanolith. MEMS MOEMS

View full text Add to dashboard Cite

show abstract

“…A lot of metals and carbon-based fillers are used in polymers to improve composite thermal conductivity. Initially, metals like copper, silver, aluminum, iron, nickel, and zinc are used priori because of their high thermal conductivity (Bjorneklett et al 1992;Sofian et al 2001;Mamunya et al 2002;Boudenne et al 2004), but because of their high density, carbon-based fillers replaced the metals, as incorporation of carbon and graphite into the polymer gives immense rise in the thermal conductivity of the composites (Yasmin and Daniel 2004;Han and Fina 2011). In spite of having high thermal conductivity, metals, graphite, and carbon fibers=fillers are not suitable for the present application because of their high electrical conductivity, as low dielectric constant is the prime requirement for such applications.…”

Section: Introductionmentioning

confidence: 99%

Epoxy Composites Filled with Micro-Sized AlN Particles for Microelectronic Applications

Agrawal

Satapathy

2014

Particulate Science and Technology

View full text Add to dashboard Cite

With the rapid development of the electronic information industry, better properties are required for substrate and packaging materials such as high thermal conductivity, low coefficient of thermal expansion, and low dielectric constant. Polymers are ordinarily being used for this purpose due to their high electrical resistivity and low density, but unfortunately they suffer from a disadvantage like low thermal conductivity. To offset this deficiency, adding inorganic conductive particles to polymer is a versatile method. In view of this, the present work aims at developing a class of particulate filled polymer composites with micro-sized aluminum nitride (AlN) particles having an average particle size of 60-80 mm reinforced in epoxy matrix. A set of composites, with filler content ranging from 0 to 25 vol%, have been prepared by the hand-layup technique. Effects of filler percentage on various properties like effective thermal conductivity (k eff ), coefficient of thermal expansion (CTE), glass transition temperature (T g ), and dielectric constant (E c ) are studied. It is found that the incorporation of AlN in resin increases the k eff and T g , whereas CTE of the composite decreases favorably. Though dielectric constant of the matrix increases with filler content yet it remains well within the desirable limit. With modified thermal and dielectric characteristics, these composites can possibly be used for microelectronics applications.

show abstract

“…A lot of metal and ceramic fillers are used in polymers to increase composite thermal conductivity. Initially, metal phases (copper, nickel, aluminum, and silver) were used as a priori because of their high conductivity [4,5]. Ceramic materials such as boron nitride (BN), aluminum nitride (AlN), silicon carbide (SiC), and silicon nitride (Si 3 N 4 ) were then gradually regarded as potential fillers [6][7][8][9][10][11].…”

Section: Introductionmentioning

confidence: 99%

Study on thermal conductive BN/novolac resin composites

Liu

et al. 2011

Thermochimica Acta

View full text Add to dashboard Cite

Thermal conductivity of epoxy adhesives filled with silver particles

Cited by 70 publications

References 6 publications

Use of conductive adhesive for MEMS interconnection in ammunition fuze applications

Use of conductive adhesive for MEMS interconnection in ammunition fuze applications

Epoxy Composites Filled with Micro-Sized AlN Particles for Microelectronic Applications

Study on thermal conductive BN/novolac resin composites

Contact Info

Product

Resources

About