Thermal conductivity of B2-type aluminides and titanides

Terada, Yoshihiro; Ohkubo, Kenji; Nakagawa, Kiyotaka; Mohri, Tetsuo; Suzuki, Tomoo

doi:10.1016/0966-9795(95)94253-b

Cited by 93 publications

(49 citation statements)

References 38 publications

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“…2, where the constituent X denotes Fe, Co and Ni arranged according to the periodic table. 32) For the aluminides, the thermal conductivity increases with increasing the atomic number of the constituent X. This increasing manner holds also for the gallides, while the thermal conductivity of XGa is much smaller than that of XAl.…”

Section: Constituent Dependencementioning

confidence: 67%

“…Figure 1 shows the composition dependence of thermal conductivity at 300 K of B2 type aluminides; NiAl, CoAl and FeAl. 32,35) The thermal conductivity of the stoichiometric NiAl obtained by Darolia is also shown in the figure.…”

Section: Composition Dependencementioning

confidence: 99%

“…1 Composition dependence of thermal conductivity at 300 K of NiAl, CoAl and FeAl. 32) The thermal conductivity of the stoichiometric NiAl obtained by Darolia is also shown with a solid circle. 8) maximum at stoichiometry is not clearly observed in FeAl with lower conductivity.…”

Section: Composition Dependencementioning

confidence: 99%

“…33) Fig. 2 Thermal conductivity at stoichiometry of B2-type aluminides (XAl), gallides (XGa) and titanides (XTi) against the constituent X at 300 K. 32) Fig . 3 Thermal conductivity of NiAl as a function of Al concentration at various temperatures between 300 K and 1100 K.…”

Section: Constituent Dependencementioning

confidence: 99%

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Thermal Conductivity of Intermetallic Compounds with Metallic Bonding

et al. 2002

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Thermal conductivity is one of the key parameters required for high-temperature structural applications of metallic materials. In this overview, the thermal conductivity of intermetallic compounds are extensively described based mainly on our past works, since there had been less works in this research field. Emphasis is placed on the B2 and the L1 2 compounds with metallic bonding such as NiAl, Ni 3 Al, etc., which have been attracting attention for engineering applications at higher temperatures. The thermal conductivity data have been accumulated for the intermetallic compounds, and the phenomenological aspects are reviewed in detail as a function of alloy composition, constituent and temperature. The Wiedemann-Franz law is applicable to the intermetallic compounds, indicating that the carrier of thermal conduction is an electron rather than a phonon. The thermal conductivity of an intermetallic compound with the ordered crystal structure is characterized as an enhancement due to ordering with reference to the basic contribution of solid solution with the disordered crystal structure. It is demonstrated that the thermal conductivity of intermetallic compounds is reduced by the addition of a third element, and this subject is also covered.

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Section: Constituent Dependencementioning

confidence: 67%

Section: Composition Dependencementioning

confidence: 99%

Section: Composition Dependencementioning

confidence: 99%

Section: Constituent Dependencementioning

confidence: 99%

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Thermal Conductivity of Intermetallic Compounds with Metallic Bonding

et al. 2002

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“…β-NiAl has a thermal conductivity 4-8 times greater than current Ni based superalloys. This extremely large value of 92 W mK [23] was a major driving force behind researching turbine blade materials based on β-NiAl [15].…”

Section: Physical Propertiesmentioning

confidence: 99%

High Temperature coatings based on β-NiAI

Severs

2012

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Acoustic properties of piezoelectric cubic crystals

Ballato

2023

Int J Ceramic Engine & Sci

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This paper is offered as a complementary adjunct to the many treatments of the electronic and photonic properties of cubic III–V and II–VI compounds appearing in the literature. These crystals typically exhibit piezoelectricity, due to the molecular dissymmetry, thereby allowing the inclusion of classical mechanical/acoustic features along with the quantum. We discuss the history of this modality and then illustrate its use by applying it to an electro‐elastic problem that has the estimable virtues of having an exact solution, along with wide practical applicability: determination of the piezocoupling values governing the excitation of thickness vibrations in thin cubic films or plates of arbitrary crystallographic orientation by electric fields directed either along, or lateral to, the thickness. Explicit results are given for orientations along the great‐circle paths connecting the principal directions [100], [110], and [111]. The formalism is then applied to GaAs as an example; it is further demonstrated that various results, such as the orientational variations of piezocoupling factors, are generally applicable to other members of the III–V and II–VI families by scaling. Ancillary aspects, such as errors due to misorientations, nonlinearities, and equivalent circuit representations, are described and discussed. This work is dedicated to Gerald W. Farnell (1925–2015), Prof. Emeritus, McGill University, Montréal, Canada.

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Thermal conductivity of B2-type aluminides and titanides

Cited by 93 publications

References 38 publications

Thermal Conductivity of Intermetallic Compounds with Metallic Bonding

Thermal Conductivity of Intermetallic Compounds with Metallic Bonding

High Temperature coatings based on β-NiAI

Acoustic properties of piezoelectric cubic crystals

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