Thermal conductivity, mechanical properties and thermomechanical analysis of fiber composite laminates with BN coating

Zhang, Chenglin; Gu, Guohua; Dong, Shuhua; Wei, Chuncheng; Lin, Zhongqin; Tan, Hongsheng

doi:10.1007/s10973-021-11066-w

Cited by 3 publications

(6 citation statements)

References 33 publications

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“…It was ascribable to the severe agglomeration of SiC NWs, which disrupted the heat transfer path. A similar phenomenon also appeared in the work of Ren et al [41] The thermal effusivity (e) was a critical parameter reflecting the heat storage capacity, [42] which measured the internal thermal stability of the material and could be calculated from the formula (3). [43] F I G U R E 1 0 SEM images of fracture surface after flexural tests: (A) pure composites and (B-G) 2%-15% SiC NWs-modified composites…”

Section: Thermal Propertiessupporting

confidence: 62%

“…The thermal effusivity ( e ) was a critical parameter reflecting the heat storage capacity, [ 42 ] which measured the internal thermal stability of the material and could be calculated from the formula (). [ 43 ]

e goodbreak= ((), ρ C_{p} λ)

…”

Section: Resultsmentioning

confidence: 99%

“…As the thermal conductivity increases, the material can transfer heat faster as the temperature changes, thus maintaining its thermal stability. [ 42 ] A schematic diagram of the thermal conduction mechanism of the laminates containing SiC NWs is shown in Figure 11C. The efficient distribution of SiC NWs in the PPBESK through contact or stacking created a network of interconnected thermal pathways.…”

Section: Resultsmentioning

confidence: 99%

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Enhanced mechanical and thermal properties of carbon fiber‐reinforced thermoplastic copoly(phthalazinone ether sulfone ketone) composites

Wang

et al. 2022

Polymer Composites

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This paper presented a facile and effective way to modify copoly(phthalazinone ether sulfone ketone) (PPBESK) resin with SiC nanowires (SiC NWs) to improve the mechanical and thermal properties of CF/PPBESK composites. The results showed that linear SiC NWs with a diameter of about 3 μm and length of about 100 μm were uniformly incorporated into the composite, which greatly enhanced the toughness of the PPBESK resin and the interfacial performance between the CF and PPBESK. Compared with the untreated compos-

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Section: Thermal Propertiessupporting

confidence: 62%

e goodbreak= ((), ρ C_{p} λ)

…”

Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

See 1 more Smart Citation

Enhanced mechanical and thermal properties of carbon fiber‐reinforced thermoplastic copoly(phthalazinone ether sulfone ketone) composites

Wang

et al. 2022

Polymer Composites

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“…The tan δ refers to the ratio of loss modulus ( E ″) to E ′, which is related to the internal friction caused by the molecular movement of composites 25 . The tan δ curves of composites are exhibited in Figure 4c, the peaks correspond to the fastest decreasing positions of E ′ in Figure 4b.…”

Section: Resultsmentioning

confidence: 99%

Interfacial and tensile properties improvement of composites using a modified matrix with epoxy‐terminated hyperbranched polyether sulfone

Zhu

Lü

et al. 2022

J of Applied Polymer Sci

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The carbon fiber/epoxy resin (CF/EP) composites have been prepared using CF and the diglycidyl ether of bisphenol‐A (DGEBA) matrix, modified by a new epoxy‐terminated hyperbranched polyether sulfone (EHPES). Compared with CF/DGEBA composite, the modified CF/EHPES composites achieve excellent performances. The tensile strength, modulus, and elongation at break are increased by 19.1%, 7.9%, and 66.7%, respectively. The results are mainly caused by the strong interfacial properties, the interfacial shear strength (IFSS) of CF/7% EHPES composite is increased by 20.7%. Many crosslinking points enhance the mechanical interlocking between the DGEBA/EHPES matrix and CF surface. The strengthened chemical bonding promotes the formation of a higher density crosslinking network. This study provides a strategy for the domestication of large diameter wind turbine blades.

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“…Material thermal analysis technologies are frequently used to evaluate temperature-dependent properties of substances under programmed heating, which can be applied for the characterization and investigation of structure decomposition, thermal stability and phase transition, food safety assessment and drug evaluation [ 1 , 2 , 3 , 4 ], etc. By using the method of programmed temperature increase, various types of thermal analysis techniques can be used such as thermogravimetric analysis (TG or TGA) [ 5 ], differential thermal analysis (DTA) [ 6 ], differential scanning calorimetry (DSC) [ 7 ] and thermomechanical analysis (TMA, DMA) [ 8 , 9 ].…”

Section: Introductionmentioning

confidence: 99%

Chip-Based MEMS Platform for Thermogravimetric/Differential Thermal Analysis (TG/DTA) Joint Characterization of Materials

Zhou

Yao

et al. 2022

Micromachines

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Combined use of thermal analysis techniques can realize complementarity of different characterization methods. Comprehensive thermal analysis with both thermogravimetric analysis and differential thermal analysis (TG/DTA) can measure not only mass change of a sample but also its temperature change during programmed heating-induced reaction or phase transition processes, thereby obtaining multiaspect thermal information of the material such as dehydration, structural decomposition, phase change and thermal stability. This study proposes and develops a MEMS chip-based TG/DTA microsystem that integrates both programmed heating and detecting elements into a TG chip and a DTA chip to enable the microinstrument performing TG/DTA joint characterization under microscope observation. The TG chip contains a self-heating resonant microcantilever to measure heating-induced mass change of a sample and the DTA chip is with a microheater and a temperature-detecting thermopile integrated on a suspended thermal-insulating diaphragm. Only nanogram and microgram-level samples are needed for the TG and DTA chips, thereby achieving safe measurement to energetic materials such as strong oxidants. The chip-based microinstrument surpasses the state-of-the-art commercial TG/DTA instruments that have, in the long term, suffered from large sample-amount (milligram level) requirements and have been unable to measure energetic materials. Compared with commercial instruments, the chip-based microinstrument is advantageous given its more accurate analysis, much higher heating rate, much smaller instrument volume and much lower power consumption, etc. The microinstrument has been fabricated by using wafer-level MEMS techniques. Testing results show that the mass-detection sensitivity of the TG-chip is as high as 0.45 Hz/pg in air and the temperature sensitivity of the DTA chip achieves 2.9 mV/K under the high heating rate of 25 °C/s. The strong oxidant of KMnO4 is analyzed with the TG/DTA joint characterization under microscopic observation. At the same time as microscope observation of the thermal decomposition phenomena, two-step thermal decomposition process of KMnO4 is identified and the thermal decomposition temperatures are obtained. The TG/DTA microinstrument is promising to be applied for study of various materials.

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Thermal conductivity, mechanical properties and thermomechanical analysis of fiber composite laminates with BN coating

Cited by 3 publications

References 33 publications

Enhanced mechanical and thermal properties of carbon fiber‐reinforced thermoplastic copoly(phthalazinone ether sulfone ketone) composites

Enhanced mechanical and thermal properties of carbon fiber‐reinforced thermoplastic copoly(phthalazinone ether sulfone ketone) composites

Interfacial and tensile properties improvement of composites using a modified matrix with epoxy‐terminated hyperbranched polyether sulfone

Chip-Based MEMS Platform for Thermogravimetric/Differential Thermal Analysis (TG/DTA) Joint Characterization of Materials

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