Thermal conductivity and dielectric properties of immiscible LDPE/epoxy blend filled with hybrid filler consisting of HGM and nitride particle

Zhu, B.L.; Wang, J.; Zheng, Heng; Ma, Jing; Wu, Jun; Gan, Zhanghua; Liu, J.

doi:10.1016/j.jallcom.2017.01.182

Cited by 35 publications

(17 citation statements)

References 39 publications

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“…A material with superior “K” and smaller D k and D f values is highly preferred for micro‐electronic packaging as well as substrate material. BL Zhu et al has prepared a mixture of 3 different fillers namely hollow glass microsphere (HGM) added with AlN hybrid fillers and HGM added with BN hybrid fillers. They concluded that the BN added composite shows better “K” and smaller D k value compared with AlN reinforced composite, and proposed optimum values for HGM with BN were presented.…”

Section: Role and Effect Of Filler/hybrid Filler Addition On Thermal mentioning

confidence: 99%

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Role, effect, and influences of micro and nano‐fillers on various properties of polymer matrix composites for microelectronics: A review

Balasubramanian

Ramesh²

2018

Polymers for Advanced Techs

138

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Ever since the discovery of polymer composites, its potential has been anticipated for numerous applications in various fields such as microelectronics, automobiles, and industrial applications. In this paper, we review filler reinforced polymer composites for its enormous potential in microelectronic applications. The interface and compatibility between matrix and filler have a significant role in property alteration of a polymer nanocomposites. Ceramic reinforced polymeric nanocomposites are promising candidate dielectric materials for several micro‐ and nano‐electronic devices. Because of its synergistic effect like high thermal conductivity, low thermal expansion, and dielectric constant of ceramic fillers with the polymer matrix, the resultant nanocomposites have high dielectric breakdown strength. The thermal and dielectric properties are discussed in the view of filler alignment techniques and its effect on the composites. Furthermore, the effect of various surface modified filler materials in polymer matrix, concepts of network forming using filler, and benefits of filler alignment are also discussed in this work. As a whole, this review article addresses the overall view to novice researchers on various properties such as thermal and dielectric properties of polymer matrix composites and direction for future research to be carried out.

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Section: Role and Effect Of Filler/hybrid Filler Addition On Thermal mentioning

confidence: 99%

“…The following reaction occurs while dissolving solid NaOH in water. Aluminum nitride (AlN) 320 [20][21][22] Silicon nitride (Si 3 N 4 ) 200 to 320 19,21 Boron nitride (BN) 320 20,23 Carbon nanotubes (CNTs) 2800 to 3000 22 Graphene (GE) 5000 22 5 | SOME THERMAL CONDUCTIVITY MODELS…”

Section: Synthesis Of Magnetically Responsive Filler (Mrf)mentioning

confidence: 99%

Role, effect, and influences of micro and nano‐fillers on various properties of polymer matrix composites for microelectronics: A review

Balasubramanian

Ramesh²

2018

Polymers for Advanced Techs

138

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“…Examples of such models include those developed to describe thermal conductivity of hollow glass microsphere and polymer composites. [35][36][37][38] To understand the dependence of the loaded microcapsule volume fraction, 4 f , on thermal conductivities, the experimental results were compared to a theoretical model of heat transfer in hollow microsphere composites, k. 39 The model used in this study is expressed as follow (eqn (1)):…”

Section: Resultsmentioning

confidence: 99%

Hollow polymer microcapsule embedded transparent and heat-insulating film

2018

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“… LDPE epoxy & HGM, BN, Hollow glass microsphere 50 vol. 0.7 (30 vol.% BN and HGM, LDPE/Epoxy = 3:7 ~370 Physical Mixing 2017 [ 169 ] 11. HDPE BN-CNT 30 wt.…”

Section: Thermal Conductivity Of Polyolefin Compositesmentioning

confidence: 99%

Thermally enhanced polyolefin composites: fundamentals, progress, challenges, and prospects

Chaudhry

Mabrouk

Abdala

2020

Science and Technology of Advanced Materials

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The low thermal conductivity of polymers is a barrier to their use in applications requiring high thermal conductivity such as electronic packaging, heat exchangers, and thermal management devices. Polyolefins represent about 55 percent of global thermoplastic production, and therefore improving their thermal conductivity is essential for many applications. This review analyzes the advances in enhancing the thermal conductivity of polyolefin composites. First, the mechanisms of thermal transport in polyolefin composites and the key parameters that govern conductive heat transfer through the interface between the matrix and the filler are discussed. Then the advantage with different thermally conductive fillers are reviewed and analyzed. Finally, the key challenges and future directions for developing thermally enhanced polyolefin composites are outlined.

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Thermal conductivity and dielectric properties of immiscible LDPE/epoxy blend filled with hybrid filler consisting of HGM and nitride particle

Cited by 35 publications

References 39 publications

Role, effect, and influences of micro and nano‐fillers on various properties of polymer matrix composites for microelectronics: A review

Role, effect, and influences of micro and nano‐fillers on various properties of polymer matrix composites for microelectronics: A review

Hollow polymer microcapsule embedded transparent and heat-insulating film

Thermally enhanced polyolefin composites: fundamentals, progress, challenges, and prospects

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