Thermal conditions and stress-strain state in the grain-matrix system of diamond tools

Structural-Phase State of the Interphase Boundary at Thermal Diffusion Metallization of Diamond Grains by Fe, Ni and Co

“…As it is shown in fig. 1b, c metallized areas are localized mainly on the edges of the crystal and on the defective areas of the diamond surface, which is consistent with the results of [2,[11][12][13][14].…”

A Review of the Diamond Retention Capacity of Metal Bond Matrices

“…where P y is the tensile yield stress for the matrix material; R is the radius of the plastic zone; K m , µ m and α m are the bulk modulus, shear modulus and coefficient of thermal expansion of the matrix respectively; K 1 and α 1 are the bulk modulus and coefficient of thermal expansion of the diamond, respectively; and ∆T is the temperature decrease during cooling. In recent years, numerical computation methods have been widely used to study diamond retention in the matrix, and have been utilized to evaluate thermal residual stresses [92][93][94][95], local plastic deformation [13,96] and interfacial pullout behavior [4,11]. Cracks are easily generated at the interface due to large thermal stresses; a decrease in thermal residual stress is beneficial to diamond retention strength [29].…”

Investigation of heating of the drilling bits and definition of the energy efficient drilling modes

“…CFD simulation of fluid dynamics processes during the flow passing around the drilling bits is carried out in the paper [10], while the papers [11,12] present calculations of the thermal and mechanical fields in a bit's matrix, which are derived by numerical calculation. At the same time, calculations [9][10][11][12] are limited by the case of stationary flushing and may not be used to study impulse well flushing.…”