2017 IEEE 67th Electronic Components and Technology Conference (ECTC) 2017
DOI: 10.1109/ectc.2017.49
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Thermal Compression Bonding: Understanding Heat Transfer by in Situ Measurements and Modeling

Pieter Bex
1
,
Teng Wang
2
,
Melina Lofrano
3
et al.
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Cited by 10 publications
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References 12 publications
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Development of Flip Chip Bonding Process on Silicon Interposer by Using Copper Pillar

Guo
1
,
Wang
2
,
Zhang
3
et al. 2022
Proceedings of the Eighth Asia International Symposium on Mechatronics
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Development of Flip Chip Bonding Process on Silicon Interposer by Using Copper Pillar

Guo
1
,
Wang
2
,
Zhang
3
et al. 2022
Proceedings of the Eighth Asia International Symposium on Mechatronics
0
0
0
0
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Highly Productive Solder Interconnect Formation by Bump Stabbing for 3D-TSV Die Stacking

Fukuzumi1,
Onozeki
2
,
Suzuki
3
et al. 2018
2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
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3D Stacking Process with Thermo-Sonic Bonding Using Non-conductive Film

Yamatsu
1
,
Watanabe
2
,
Kanagawa
3
et al. 2018
2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
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