Thermal characterization of thin films: A chip-based approach for in-plane property analysis

Abstract

Accurate measurement of thermal properties in thin films is crucial for optimizing devices and deepening our understanding of heat transfer at nano and micro scales. This study presents a combined experimental and computational investigation on a chip-integrated technique for the assessment of in-plane thermal properties of thin films. This method stands out by incorporating inherent error cancelation to lessen the impact of radiative heat loss and allows simultaneous, independent determination of both thermal conductivity and diffusivity through straightforward linear fittings from the same dataset, reducing error propagation. We examine an 84 nm thick SiNx membrane over a temperature range from 100 K to nearly 500 K, aligning with previous studies. Further investigations into a conducting polymer film post-doping demonstrate a notable increase in both thermal conductivity and diffusivity, corroborating scanning thermal microscopy observations, confirming the technique's efficacy and reliability.