Thermal characterization of thermal interface material bondlines

Fullem, Travis Z.; Rae, David F.; Sharma, Anju; Wolcott, J.A.; Cotts, E. J.

doi:10.1109/itherm.2008.4544268

Cited by 4 publications

(1 citation statement)

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“…This important role of TIM steered various researches to work on the advancement of thermal interface materials in order to promote a more efficient heat transport in microelectronic device. [1] Requirements for an ideal TIM are high thermal conductivity (polymer matrix composites range from 1-5 W/mK), good adhesion, pliable, would not leak out of interface, non-toxic, ease of handling, stable under thermal cycling, low specific weight, low cost and low thermal resistance. In the market today, commercially available TIMs include greases, solders and silicone rubber filled with metal or ceramic nanopowders.…”

Section: Introductionmentioning

confidence: 99%

Thermal Conductivity Enhancement in Polymer-Clay Nanocomposite Using Casting Techniques

Razonado

Suarnaba

Madriaga

et al. 2020

MSF

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Nowadays, there is a need for efficiency and miniaturization in electronic products. However, in the chip level, heat dissipation can limit the performance of these gadgets. Semiconductor industries addressed this thermal management challenge by using thermal interface material. Previous studies have shown that polymer-clay nanocomposite has an enhanced thermal conductivity which can be used as a thermal interface material. In this study, the aim was to determine the effect of casting techniques on the microstructure and thermal conductivity of the polymer-clay nanocomposites. Solution intercalation method was used in fabricating the 5vol% polymer-clay nanocomposite. Organo-modified montmorillonite (MMT) was dispersed in unsaturated polyester (UP) matrix by means of high frequency ultrasonication and formed using two casting techniques; mold casting and tape casting. Results showed a slight increase in the thermal conductivity coefficient of the tape-casted samples at 2.99 W/m-K compared to the mold-casted samples at 2.87 W/m-K. Transmission electron microscopy (TEM) and x-ray diffraction (XRD) results exhibited dispersed microstructure for both casting techniques. Polymer intercalation of ~16% increase in d-spacing of clay for mold-casted samples and with a ~20% increase in d-spacing of clay for tape-casted samples were observed. With these microstructure modifications, the increase in the thermal conductivity coefficient of the tape-casted samples can be attributed to the shear force employed by the tape casting technique.

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Section: Introductionmentioning

confidence: 99%