Thermal characterization and challenges of advanced interconnects (Invited)

Non-Uniform Temperature Distribution in Interconnects and Its Impact on Electromigration

“…Such overall effect is aggravated by technology scaling and larger current density. The mean values for the parameters are obtained from recent experimental reports on modern manufacturing processes [4][5][6][7]. This model confirms that for novel technologies [12][13][14][15][16][17], neglecting the temperature evolution and its impact on interconnect reliability and their lifetime may lead to wrong conclusions or catastrophic failures.…”

“…However, the corresponding current and the interconnect width are used appropriately. The mean values for the parameters are obtained from recent experimental reports on modern manufacturing processes of major foundries [4][5][6][7] [13][14][15][16][17]. Due to the space limit, the effects are shown for local interconnects only; similar observations can be made for other layers.…”

“…The segment is then properly constructed in COMSOL Multiphysics [12]. The values for geometrical, electrical, mechanical and thermal properties of technology are obtained from various recent reports of major foundries for 10nm [4][5][6] [13][14][15][16][17]. Via effect which explains the inter-layer heat transfer is also employed for realistic and accurate modeling [1] [9].…”

“…However, to our knowledge, the mutual interaction between them has not been discussed. Since the thermal effect on aging can no longer be neglected for modern technologies [4][5][6], we present novel formulas for mortality of interconnects under thermal load. We provide a comprehensive study using our models to see how various thermal profiles influence material migration through hydrostatic stress analysis.…”