Thermal boundary resistance of copper phthalocyanine-metal interface

Jin, Y.; Yadav, Ajay K.; Sun, Kien-Wen; Sun, Haixin; Pipe, Kevin P.; Shtein, Max

doi:10.1063/1.3555449

Cited by 41 publications

(41 citation statements)

References 24 publications

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“…(1) are comparable for ρ int ≈ 3 x 10 -7 m 2 K/W. This value is only about an order of magnitude larger than that of evaporated metal, 23,24 oxide, 25 or organometallic 26 films on ceramic or metal substrates, close to the value of evaporated polycrystalline pentacene films on silicon oxide, 6 and an order of magnitude smaller than the interface resistances of the best epoxy resins 27 or thermal greases.…”

Section: Introductionmentioning

confidence: 59%

Thermal resistances of thin films of small molecule organic semiconductors

et al. 2016

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Abstract:We have measured the thermal resistances of thin films of the small molecule organic semiconductors bis(triisopropylsilylethynyl) pentacene (TIPS-pn), bis(triethylsilylethynyl) anthradithiophene (TES-ADT) and difluoro bis(triethylsilylethynyl) anthradithiophene (diF-TES-ADT). For each material, several films of different thicknesses have been measured to separate the effects of intrinsic thermal conductivity from interface thermal resistance. For sublimed films of TIPS-pn and diF-TES-ADT, with thicknesses ranging from < 100 nm to > 4 µm, the thermal conductivities are similar to that of polymers and over an order of magnitude smaller than that of single crystals, presumably reflecting the large reduction in phonon mean-free path in the films. For thin (≤ 205 nm) crystalline films of TES-ADT, prepared by vapor-annealing spin-cast films, the thermal resistances are dominated by interface scattering.

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Section: Introductionmentioning

confidence: 59%

Thermal resistances of thin films of small molecule organic semiconductors

et al. 2016

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“…Therefore, phonons in a NW bundle are scattered at the interface, leading to a phonon mean free path that is the same or less than that of a single free-standing NW. In general, nanostructure ensembles have lower thermal conductivity than a single nanostructure because of the presence of van der Waals interactions48495051. Hone et al 48.…”

Section: Resultsmentioning

confidence: 99%

Thermal and Thermoelectric Transport in Highly Resistive Single Sb2Se3 Nanowires and Nanowire Bundles

Shellaiah

Sun

2016

Sci Rep

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In this study, we measured the thermal conductivity and Seebeck coefficient of single Sb2Se3 nanowires and nanowire bundles with a high resistivity (σ ~ 4.37 × 10−4 S/m). Microdevices consisting of two adjacent suspended silicon nitride membranes were fabricated to measure the thermal transport properties of the nanowires in vacuum. Single Sb2Se3 nanowires with different diameters and nanowire bundles were carefully placed on the device to bridge the two membranes. The relationship of temperature difference on each heating/sensing suspension membranes with joule heating was accurately determined. A single Sb2Se3 nanowire with a diameter of ~ 680 nm was found to have a thermal conductivity (kNW) of 0.037 ± 0.002 W/m·K. The thermal conductivity of the nanowires is more than an order of magnitude lower than that of bulk materials (k ~ 0.36–1.9 W/m·K) and highly conductive (σ ~ 3 × 104 S/m) Sb2Se3 single nanowires (k ~ 1 W/m·K). The measured Seebeck coefficient with a positive value of ~ 661 μV/K is comparable to that of highly conductive Sb2Se3 single nanowires (~ 750 μV/K). The thermal transport between wires with different diameters and nanowire bundles was compared and discussed.

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“…In our derivation of κ, we assumed that interfacial thermal resistances were negligible compared to the film thermal resistance; the derived κ therefore represents a lower bound for the film thermal conductivity 26 . For pure PAP and pure PAA, the underestimation of κ is estimated to be 5%, using interfacial thermal resistances previously measured for similar interfaces 13,26,27 . Comparisons between the film thicknesses used and the polymers' radii of gyration do not indicate a contribution of reduced thermal boundary resistance 28 to the measured thermal conductivity enhancements (Supplementary Information).…”

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confidence: 99%

High thermal conductivity in amorphous polymer blends by engineered interchain interactions

et al. 2014

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Thermal conductivity is an important property for polymers, as it often affects product reliability (for example, electronics packaging), functionality (for example, thermal interface materials) and/or manufacturing cost. However, polymer thermal conductivities primarily fall within a relatively narrow range (0.1-0.5 W m(-1) K(-1)) and are largely unexplored. Here, we show that a blend of two polymers with high miscibility and appropriately chosen linker structure can yield a dense and homogeneously distributed thermal network. A sharp increase in cross-plane thermal conductivity is observed under these conditions, reaching over 1.5 W m(-1) K(-1) in typical spin-cast polymer blend films of nanoscale thickness, which is approximately an order of magnitude larger than that of other amorphous polymers.

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Thermal boundary resistance of copper phthalocyanine-metal interface

Cited by 41 publications

References 24 publications

Thermal resistances of thin films of small molecule organic semiconductors

Thermal resistances of thin films of small molecule organic semiconductors

Thermal and Thermoelectric Transport in Highly Resistive Single Sb2Se3 Nanowires and Nanowire Bundles

High thermal conductivity in amorphous polymer blends by engineered interchain interactions

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