Thermal boundary resistance and temperature dependent phonon conduction in CNT array multilayer structure

Wang, Z.L.; Mu, Hong-Min; Liang, J.G.; Tang, Da Wei

doi:10.1016/j.ijthermalsci.2013.07.006

Cited by 34 publications

(12 citation statements)

References 38 publications

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“…In this regard, interface plays a key role because of influence of factors such as lattice mismatch [256,268] and phonon scattering [267,269]. Wang et al reported that the interfacial resistance and phonon scattering are due to the incomplete contact at the interface (MWCNTs in their study) [270]. Moreover, it has been reported that the resistance of the solid-liquid interface is a function of properties of adsorbed liquid layers [271].…”

Section: Thermal Conductivitymentioning

confidence: 99%

A review on the role of interface in mechanical, thermal, and electrical properties of polymer composites

Kashfipour

Mehra

Zhu

2018

Adv Compos Hybrid Mater

157

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Composite materials and especially polymer composites are widely used in daily life and different industries due to their vastly different properties and design flexibility. It is known that the properties of the composites are strongly related to the properties of its constituents. However, it has been reported in many studies, experimentally and by simulations, that the characteristics of the composites do not follow the rule of mixing. It means that in addition to properties of the constituents, there are other parameters affecting the final physicochemical properties of composites. The interfacial interactions between fillers and host is one of the factors which can strongly affect the properties of the composite. In this review, we summarized the type of interactions between the constituents, their improvement techniques, interaction measurement methods, and the effects of interfacial interactions on thermal, mechanical, and electrical properties of composites.

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Section: Thermal Conductivitymentioning

confidence: 99%

A review on the role of interface in mechanical, thermal, and electrical properties of polymer composites

Kashfipour

Mehra

Zhu

2018

Adv Compos Hybrid Mater

157

View full text Add to dashboard Cite

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“…Thermal boundary resistance and temperature-dependent phonon conduction in multilayer structures were studied by Wang et al [2]. They demonstrated that the temperature dependency of the heat capacity measured was well consistent with predicted data.…”

Section: Introductionmentioning

confidence: 56%

Phonon transport characteristics across silicon thin film pair: Presence of a gap between the films

Ali¹,

Yilbaş²

2015

Journal of Non-Equilibrium Thermodynamics

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Phonon transport across silicon thin lm pair with minute gap (Casimir limit) between the lms is studied. Phonon transport characteristics across the gap are examined for various gap sizes, and the transient solution of the frequency-dependent Boltzmann transport equation is presented according to relevant boundary conditions incorporating the gap between the lm pair. Since the gap size is minute (Casimir limit), the radiative energy transport between the edges of the lm pair is incorporated. In addition, phonon transmission and re ection is introduced at the gap edges, thus satisfying energy conservation. The thermal conductivity predicted is validated through experimental data reported in the open literature. Predicted thermal conductivity data agree well with the experimental data reported in the open literature. Increasing gap size alters the phonon transport characteristics across the lm pair. Increasing gap size enhances temperature di erence between the edges of the gap; in which case, the e ect of phonon transmittance is more signi cant on the temperature di erence than that corresponding to the radiation heat transfer due to Casimir limit.

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“…They demonstrated that the diffusive-ballistic heat transport could be simulated for a broad range of Knudsen numbers; however, phonon-boundary scattering needed to be considered for an accurate simulation of the ballistic heat transport. TBR and temperature-dependent phonon conduction in a carbon nanotube array multilayer structure was studied by Wang et al [15]. They indicated that the phonon transport model they introduced captured the temperature dependency of the thermal capacity of the multi-wall carbon nanotube array well.…”

Section: Introductionmentioning

confidence: 99%

Phonon Transport in Silicon-Diamond Thin Film Pairs: Consideration of Thermal Boundary Resistance Due to Cutoff Mismatch and Diffusive Mismatch Models

Ali

Yilbaş

2015

Numerical Heat Transfer, Part A: Applications

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Thermal boundary resistance (TBR) generates a temperature drop across the interface of the thin film pairs, which in turn modifies the heat transport rates across the films. This effect magnifies for the dielectric films because of the boundary scattering of phonons during the energy transport. Therefore, investigation into TBR and phonon transport across thin film pairs becomes essential. In the present study, phonon transport across the silicon-diamond thin film pairs due to temperature disturbance is formulated using the first principle solution of the transport equation. The transient and frequency dependent solution of the Boltzmann transport equation is presented numerically for two-dimensional thin film pairs. The TBR at the interface of the thin film pairs is modeled incorporating the cutoff mismatch and diffusive mismatch models. It is found that the value of TBR predicted from the cutoff mismatch model agrees with the results reported in the open literature; in which case, the predictions of the cutoff mismatch model for the TBR are larger than those predicted from the diffusive mismatch model.

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Thermal boundary resistance and temperature dependent phonon conduction in CNT array multilayer structure

Cited by 34 publications

References 38 publications

A review on the role of interface in mechanical, thermal, and electrical properties of polymer composites

A review on the role of interface in mechanical, thermal, and electrical properties of polymer composites

Phonon transport characteristics across silicon thin film pair: Presence of a gap between the films

Phonon Transport in Silicon-Diamond Thin Film Pairs: Consideration of Thermal Boundary Resistance Due to Cutoff Mismatch and Diffusive Mismatch Models

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