Thermal Behaviour of Agro-waste Based Ceiling Board and Its Filler Material

Abstract

The thermal behavior of a ceiling board produced with breadfruit seed coat as the filler material, and recycled Low Density Polyethylene, as the binder, was investigated. The Breadfruit seed coat was treated with sodium hydroxide and acetic acid, to remove the pigments. The ceiling material was produced with 19.722% filer-binder ratio, and pressed for 10 minutes, at temperature and pressure of 197.31 oC and 9.042 MPa respectively. Lee-Charton’s apparatus was used to determine the thermal conductivity of the produced material, which gave a value of 0.362 Wm− 1K− 1 and the corresponding thermal diffusivity and resistivity of 5.24 x 10− 7 m2/s, and 2.76 Wm− 1K− 1, respectively. Thermo-gravimetric analyzer and Digital Scanning Calorimeter was used to study the thermal behavior the filler material and the produced sample, which showed a good thermal stability. Hence, this research showed that the produced material is suitable for ceiling board application.