Journal of Alloys and Compounds
 2023
DOI: 10.1016/j.jallcom.2023.168942
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Thermal behaviour and microstructure evolution of new ternary eutectic alloy in Al-Cu-Si-Ni system

Qing Cai
1
,
Chung Fang
2
,
C.L. Mendis
3
et al.
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