2017
DOI: 10.1016/j.apsusc.2017.05.066
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Thermal atomic layer deposition of In2O3 thin films using dimethyl(N-ethoxy-2,2-dimethylcarboxylicpropanamide)indium and H2O

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Cited by 30 publications
(27 citation statements)
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“…Figure 1 c displays the growth rate of ALD-In 2 O 3 thin films as a function of growth temperature using the optimized pulse conditions. Figure 1 c shows that the growth rate was directly dependent on the deposition temperature, increasing with temperature with no separate temperature window within which a constant growth rate was observed, as reported earlier with other conditions [ 23 , 24 ]. Otherwise, our results are inconsistent with the previous reports; ALD-deposited In 2 O 3 thin film with TMIn with ozone and TEIn with ozone was proposed in ALD process windows between 100 and 200 °C [ 29 , 31 ] and others [ 28 ].…”
Section: Resultssupporting
confidence: 82%
See 1 more Smart Citation
“…Figure 1 c displays the growth rate of ALD-In 2 O 3 thin films as a function of growth temperature using the optimized pulse conditions. Figure 1 c shows that the growth rate was directly dependent on the deposition temperature, increasing with temperature with no separate temperature window within which a constant growth rate was observed, as reported earlier with other conditions [ 23 , 24 ]. Otherwise, our results are inconsistent with the previous reports; ALD-deposited In 2 O 3 thin film with TMIn with ozone and TEIn with ozone was proposed in ALD process windows between 100 and 200 °C [ 29 , 31 ] and others [ 28 ].…”
Section: Resultssupporting
confidence: 82%
“…However, the peak intensity at lower growth temperatures was slightly higher compared to high deposition temperatures. This peak can be recognized as either surface or bulk hydroxyl–In species [ 24 , 29 , 38 ], perhaps originated from the incomplete formation of In 2 O 3 lattice or the unreacted precursor molecules embedded into the film surface. The C1 s core XPS spectra of the deposited films were examined and shown in Figure 5 d. The C1 s peaks were present in all the deposited temperatures, although it was slightly observed at the higher growth temperature present in all films and hard to glide by the ALD reaction process due to steric effect [ 23 , 28 , 29 ].…”
Section: Resultsmentioning
confidence: 99%
“…There is a seeming paradox between the variation trends of the oxygen vacancy concentration and the total O-content. In fact, they are unnecessarily related to each other since the oxygen atoms may exist as lattice oxygen, oxygen interstitials (O i ) or OH ligands with binding energies located at 529.8, 532.4 and 531.9 eV, respectively [ 24 , 25 ]. Although the (O i ) or OH components cannot be distinguished from the O1s peak, there are still possibilities that more oxygen atoms may exist as oxygen interstitials or OH ligands in the film when deposited at a relatively low substrate temperature due to the low ratio of chemically adsorbed precursors.…”
Section: Resultsmentioning
confidence: 99%
“…According to the recent reports, heteroleptic metal precursors exhibit better thermal stability and higher growth rates than those of homoleptic ones [20] . Moreover, our group recently reported the deposition of high‐quality In 2 O 3 thin films by ALD using indium metal precursors having N ‐alkoxy carboxamide ligand, especially [Me 2 In(edpa)] 2 [21] . In this study, new heteroleptic indium complexes bearing methyl, N ‐alkoxy carboxamide, and β‐diketonate ligands were synthesized.…”
Section: Introductionmentioning
confidence: 98%
“…[20] Moreover, our group recently reported the deposition of high-quality In 2 O 3 thin films by ALD using indium metal precursors having N-alkoxy carboxamide ligand, especially [Me 2 In(edpa)] 2 . [21] In this study, new heteroleptic indium complexes bearing methyl, N-alkoxy carboxamide, and β-diketonate ligands were synthesized. As shown in Scheme 1, the N-alkoxy carboxamide ligands used were Nethoxy-2,2-dimethyl propanamide (edpaH) and N-methoxy-2,2dimethyl propanamide (mdpaH), whereas 2,2,6,6-tetramethylheptan-3,5-dione (tmhdH) and acetylacetone (acacH) were used as the β-diketonate ligands.…”
Section: Introductionmentioning
confidence: 99%