“…In this paper, we suggest that the SBA method can be identified as an unusually flexible and capable approach for solid-phase thermal annealing of thin films, in general, and for improving the physical stability and properties of amorphous thin films, in particular. This suggestion regarding the stability enhancement of amorphous films via SBA is based on simultaneously considering the physical changes that are expected to transpire in amorphous materials at elevated temperatures [14], as well as based on the results obtained from thermal analysis of thin films during SBA (the results of which show, as expected, the presence of distinct individual-pulse generated short-lived temperature spikes that are superimposed on top of a multiple-pulse defined and generated overall thermal profile at a point in the irradiated films [7,19]). Specifically, the combination of the following three factors leads us to note that the SBA method is likely well suited for improving the stability and properties of amorphous thin films on high-processingtemperature-intolerant substrates: (1) the flexibility of the SBA method (in terms of varying the overall multiple-pulse-defined beam dwell time, as well as the ability to tune and engineer the degree to which the temperature spikes are manifested), (2) the kinetic nature of thermodynamically driven local topological and compositional changes involving a range of activation enthalpies that take place in amorphous materials during thermal treatments (the changes that must improve the stability of the amorphous materials), and (3) the need to kinetically avoid either the solidphase or melt-mediated crystallization of the materials (as well as to avoid inducing any damage to the high-temperature-processingintolerant substrates or subs-structures and devices).…”