1997 Proceedings 47th Electronic Components and Technology Conference
DOI: 10.1109/ectc.1997.606331
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Thermal and thermo-mechanical behavior of silicon platform with direct lead attachment

F.C.J. Anigbo1,
M.F. Dautartas2,
S.L. Broutin3
et al.

Abstract: Miniaturization, low cost, and high performance are the trends in optical data link device packaging markets. Low 0-7803-3857-W97 $4.00 Q!997 IEEE

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