2022
DOI: 10.1016/j.mtcomm.2022.103345
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Thermal and mechanical stability of microwave sintered cold compact bismuth telluride thermoelectric material

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Cited by 3 publications
(8 citation statements)
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“…Thus far, the majority of commercially available thermoelectric devices are based on Te-based thermoelectric materials, such as Bi 2 Te 3 and PbTe. Researchers have also conducted numerous studies to improve thermoelectric properties [10][11][12][13][14]. For example, KUNIHISA et al [15] reported Bi 0.4 Te 3.0 Sb 1.6 films by spin-coating.…”
Section: Introductionmentioning
confidence: 99%
“…Thus far, the majority of commercially available thermoelectric devices are based on Te-based thermoelectric materials, such as Bi 2 Te 3 and PbTe. Researchers have also conducted numerous studies to improve thermoelectric properties [10][11][12][13][14]. For example, KUNIHISA et al [15] reported Bi 0.4 Te 3.0 Sb 1.6 films by spin-coating.…”
Section: Introductionmentioning
confidence: 99%
“…The thermal conductivity of the Bi 2 Te 3 decreases with increase in temperature due to phonon–phonon interaction, k p ∝ T −1 (Umklapp scattering). [ 16,17,19,20,30 ] For the compacted PVP, PANI, Bi 2 Te 3 composite (1:2), the thermal conductivity decreased to 0.82 Wm −1 k −1 at room temperature (Table 4), which is nearly equal to the thermal conductivity of pure PANI (0.80 Wm −1 K −1 ) at room temperature. The thermal conductivity of the compacted fibers is lower than that of pure samples but higher that fibers sheet.…”
Section: Resultsmentioning
confidence: 96%
“…Non conducting polymers usually have lower thermal conductivity due to absence of electrons and high phonon scattering. [ 18,19,30,50 ] This is due to the fiber's random orientation and high porosity between composite particles in the fibers. Equation () can be used to gain an understanding of how fibers achieve their thermal conductivity. kitalicKo=italicNbBn+2<cosθ>l<D>)(<cosθ>nitalicfi, where, k /Ko is the thermal conductance of the composite (Bi 2 Te 3 and PANI), n fi is the number of composite in a cross‐section area, <D> is the average distance between two composites particles, θ is the angle between heat flow and fiber direction and Nb is a dimensionless equation (Biot number) that describes the competing effect of interfiller thermal contact resistance and intrinsic filler thermal resistance.…”
Section: Resultsmentioning
confidence: 99%
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