Thermal and Mechanical Characterization of 2.5-D and Fan-Out Chip on Substrate Chip-First and Chip-Last Packages

Shih, Meng-Kai; Lai, Wei‐Hong; Liao, Tse-Wei; Chen, Dao-Long; Hung, Chih-Pin

doi:10.1109/tcpmt.2022.3145377

Cited by 10 publications

(3 citation statements)

References 36 publications

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“…Computational fluid dynamics (CFD), for instance, is utilized to examine the interconnection of the silicon chip and LTCC substrate and the evolution of the bonding process between them [ 66 ]. According to research on the thermal properties of three different package types—2.5D package, fan-out chip on substrate (FOCoS) chip-first, and FOCoS chip-last—the junction temperature of the FOCoS type is lower than that of the 2.5D package, meaning that the substrate material and the design of the structure both have effects on the thermal properties [ 67 ]. The two FOCoSs’ shared grinding operation, which uniformly thins the material between the heat sink and the package and, so, ensures overall thermal efficiency, is the primary cause of this.…”

Section: Sip Reliability Analysis and Testingmentioning

confidence: 99%

A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging

Wang

Yang

et al. 2023

Micromachines

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The system-in-package (SiP) has gained much interest in the current rapid development of integrated circuits (ICs) due to its advantages of integration, shrinking, and high density. This review examined the SiP as its focus, provides a list of the most-recent SiP innovations based on market needs, and discusses how the SiP is used in various fields. Reliability issues must be resolved if the SiP is to operate normally. Three factors—thermal management, mechanical stress and electrical properties—can be paired with specific examples in order to detect and improve package reliability. This review provides a thorough overview of SiP technology, serves as a guide and foundation for the SiP in package reliability design, and addresses the challenges and potential for further development of this kind of package.

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Section: Sip Reliability Analysis and Testingmentioning

confidence: 99%

A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging

Wang

Yang

et al. 2023

Micromachines

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“…It was shown in [ 4 ] that the creep strain energy density (CSED) provides a reasonable index for examining the risk of solder joint cracking. Figure 15 a shows the simulation results for the CSED distribution of the FCBGA package at the end of the thermal cycling test.…”

Section: Coupled Mechanical Compression and Thermal Cycling Simulationmentioning

confidence: 99%

“…Over the past few years, demand has risen for electronic devices with increasing Input/Output (I/O) density and enhanced computational capabilities to support high-performance computing (HPC) applications such as AI (Artificial Intelligence) and machine learning. Flip Chip Ball Grid Array (FCBGA) packaging, 2.5D/3D heterogeneous integration packages, and Fan-Out Chip on Substrate (FOCoS) are the mainstay of such devices [ 1 , 2 , 3 , 4 ]. FCBGA (see Figure 1 a) is particularly common in telecom, workstation, and computer applications due to its superior bandwidth and electrical performance.…”

Section: Introductionmentioning

confidence: 99%

Reliability Evaluation of Board-Level Flip-Chip Package under Coupled Mechanical Compression and Thermal Cycling Test Conditions

et al. 2023

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Flip Chip Ball Grid Array (FCBGA) packages, together with many other heterogeneous integration packages, are widely used in high I/O (Input/Output) density and high-performance computing applications. The thermal dissipation efficiency of such packages is often improved through the use of an external heat sink. However, the heat sink increases the solder joint inelastic strain energy density, and thus reduces the board-level thermal cycling test reliability. The present study constructs a three-dimensional (3D) numerical model to investigate the solder joint reliability of a lidless on-board FCBGA package with heat sink effects under thermal cycling testing, in accordance with JEDEC standard test condition G (a thermal range of −40 to 125 °C and a dwell/ramp time of 15/15 min). The validity of the numerical model is confirmed by comparing the predicted warpage of the FCBGA package with the experimental measurements obtained using a shadow moiré system. The effects of the heat sink and loading distance on the solder joint reliability performance are then examined. It is shown that the addition of the heat sink and a longer loading distance increase the solder ball creep strain energy density (CSED) and degrade the package reliability performance accordingly.

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Comprehensive review and future prospects on chip-scale thermal management: Core of data center’s thermal management

Li,

Luo,

Jiang

et al. 2024

Applied Thermal Engineering

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Thermal and Mechanical Characterization of 2.5-D and Fan-Out Chip on Substrate Chip-First and Chip-Last Packages

Cited by 10 publications

References 36 publications

A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging

A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging

Reliability Evaluation of Board-Level Flip-Chip Package under Coupled Mechanical Compression and Thermal Cycling Test Conditions

Comprehensive review and future prospects on chip-scale thermal management: Core of data center’s thermal management

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