Thermal and dielectric properties of two‐dimensional layered MXene (Ti₃C₂T_x) filled linear low‐density polyethylene composites

Abstract

Exploring a new material MXene‐based polymer composite with high‐dielectric constant and low‐dielectric loss is important because of their potential applications in modern electronics and power systems. The two‐dimensional layered Ti3C2Tx(MXene)/linear low‐density polyethylene (LLDPE) composite have been fabricated via the solution casting method in the weight ratio of 1 to 10 of Ti3C2Txto the total weight of the polymer matrix. The formation of Ti3C2Tx filled LLDPE composite is revealed by the X‐ray diffraction, Field Emission Scanning Electron Microscope (FESEM), Fourier‐transform infrared, differential scanning calorimetry, and thermogravimetric analysis investigations. The room temperature transport behavior of the composites was studied by impedance spectroscopy technique within the frequency range of 5 Hz–5 MHz. The composites show significantly improved real dielectric permittivity of and low‐dielectric dissipation loss of the composite (maximum ε' = 9.35 × 103 with tan δ = 0.48 at 5 Hz at 25°C) at 5 phr of Ti3C2Tx loading. This work gives an auspicious idea to build polymer films with improved dielectric permittivity and low‐loss tangent for potential application in flexible electronic materials.

A review on polymers and their composites for flexible electronics

“…121 Dielectric composites, incorporating inorganic/organic fillers at micro/nanometer with high dielectric constant or polarizability owns cohesiveness, toughness and workability as well as high dielectric properties. [122][123][124]…”

“…121 Dielectric composites, incorporating inorganic/organic fillers in the micro/ nanometer range with high dielectric constant or polarizability, possess cohesiveness, toughness and workability, as well as high dielectric properties. [122][123][124] Table 2 presents a summary of the methods for the preparation of functional polymer composites and their applications.…”

Melt‐reprocessable linear low‐density polyethylene/cyclic olefin copolymer blends with low dielectric constant and low thermal expansion

“…Low‐density PE has good melt processability and relatively low melting points, as well as its low cost 6,7 . In addition to low cost and low permittivity and tan δ values, low‐density PE offers low temperature flexibility coupled with chemical and moisture resistance, making it an attractive candidate for insulation applications, especially in early cable constructions 8–13 . Nevertheless, the main disadvantages of low‐density PE include high CTE, that is, poor dimensional stability, and relatively high dielectric constants for communication cable applications.…”

“…flexibility coupled with chemical and moisture resistance, making it an attractive candidate for insulation applications, especially in early cable constructions. [8][9][10][11][12][13] Nevertheless, the main disadvantages of low-density PE include high CTE, that is, poor dimensional stability, and relatively high dielectric constants for communication cable applications. Low-density PE was later replaced by cross-linked PE due to its improved properties.…”

Cetyltrimethylammonium bromide decorated MXene/polyimide nanocomposites with enhanced dielectric properties, thermostability, and moisture resistance

“…Polymer film capacitors have been widely used due to their lightweight, good flexibility, and easy processing 1–3 . But in some extreme environments such as aerospace electronics, underground oil, and gas exploration, the poor thermal stability of polymers limits their application 4–6 . Polyimide (PI) is recognized as the most promising polymer material in the field of high temperature dielectric due to its excellent heat resistance, low dielectric loss, and good mechanical properties 7–9 .…”