Thermal and Adhesion Properties of Fluorosilicone Adhesives Following Incorporation of Magnesium Oxide and Boron Nitride of Different Sizes and Shapes

Abstract

Thermally conductive adhesives were prepared by incorporating magnesium oxide (MgO) and boron nitride (BN) into fluorosilicone resins. The effects of filler type, size, and shape on thermal conductivity and adhesion properties were analyzed. Higher thermal conductivity was achieved when larger fillers were used, but smaller ones were advantageous in terms of adhesion strength. Bimodal adhesives containing spherical MgOs with an average particle size of 120 μm and 90 μm exhibited the highest conductivity value of up to 1.82 W/mK. Filler shape was also important to improve the thermal conductivity as the filler type increased. Trimodal adhesives revealed high adhesion strength compared to unimodal and bimodal adhesives, which remained high after aging at 85 °C and 85% relative humidity for 168 h. It was found that the thermal and adhesion properties of fluorosilicone composites were strongly affected by the packing efficiency and interfacial resistance of the particles.

Lightweight Polyethylene/Hexagonal Boron Nitride Hybrid Thermal Conductor Fabricated by Melt Compounding Plus Salt Leaching

“…As been well investigated previously [ 15 , 16 , 17 , 18 ], the heat transfer in polymers is dominated by phonon transportation. For hBN reinforced polymeric materials, the heat transfer behavior can be altered by the phonon transitions in and between hBN and polymer matrix, thus, the formation of hBNs’ network is essential not only as pathways for phonons transportation, but also avoid their scatterings in the polymer/gas interfaces.…”

In situ generated gas bubble-directed self-assembly of multifunctional MgO-based hybrid foams for highly efficient thermal conduction, microwave absorption, and self-cleaning

“…6d). 2,5,7,9,11,[35][36][37][38][39][40][41][42][43][44][45][46]48 The heat transfer pathway of foams largely depends on their composition. Herein, MgO/Mg(OH) 2 /C foams are composed of MgO, Mg(OH) 2 , and amorphous C; MgO/Co/C foams consist of Co 0 , MgO, and amorphous C. Heat is transferred via electrons in Co 0 and crystal lattice vibrations (phonons) in MgO, Mg(OH) 2 , amorphous C, and pure silica films.…”