Thermal Analysis of Solder Joint Based on Eddy Current Pulsed Thermography

Zhou, Xiaojian; Xue, Yun; Tian, Guohui

doi:10.1109/tcpmt.2017.2696159

Cited by 18 publications

(7 citation statements)

References 21 publications

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“…Utilization of thermography method for inspection of IC packaging goes back to more than half a century ago [ 88 , 89 , 90 , 91 ], and since then it has been one of the most promising NDT methods to inspect electronic packaging [ 8 , 9 , 92 ]. IRT is used to inspect flip chips [ 93 , 94 ], solder joint defects [ 94 , 95 ], edge defects [ 33 ], misalignment of solder bumps [ 96 ], presence and location of microsolder bumps (as small as approximately 100 µm in diameter and 250 µm in pitch) [ 94 , 97 , 98 ], silicon crack [ 99 ], underfill void [ 99 ], delamination defects with minimum size about 2 µm [ 100 ], and subsurface defects (up to 4 mm in depth) [ 101 ].…”

Section: Ndt Methods For Ic Packagingmentioning

confidence: 99%

“…For thermal imaging, the passive method relies on natural heat emitted from the structures or structural components in service without any additional external heat source and the infrared detectors senses thermal radiation [ 102 ]. On the other hand, the active method exerts an external heat to the parts to be inspected using optical [ 8 ], mechanical [ 84 ] or electromagnetic [ 95 ] sources. The external heat creates thermal waves on the surface of the specimen, and the thermal waves reflect back from a defect or anomaly within the object under inspection [ 103 ].…”

Section: Ndt Methods For Ic Packagingmentioning

confidence: 99%

“…The reflected wave oscillates at the same frequency as the thermal wave [ 106 ]. The active thermography methods have been adopted extensively to inspect the IC packaging (pulsed [ 94 , 95 , 107 , 108 ] and lock-in [ 92 , 93 , 101 , 109 ]). A sample setup (both schematic and actual) of the active thermography is shown in Figure 13 .…”

Section: Ndt Methods For Ic Packagingmentioning

confidence: 99%

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An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection

Aryan

Sampath

Sohn

2018

Sensors

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The article provides a review of the state-of-art non-destructive testing (NDT) methods used for evaluation of integrated circuit (IC) packaging. The review identifies various types of the defects and the capabilities of most common NDT methods employed for defect detection. The main aim of this paper is to provide a detailed review on the common NDT methods for IC packaging addressing their principles of operation, advantages, limitations and suggestions for improvement. The current methods such as, X-ray, scanning acoustic microscopy (SAM), infrared thermography (IRT), magnetic current imaging (MCI) and surface acoustic waves (SAW) are explicitly reviewed. The uniqueness of the paper lies in comprehensive comparison of the current NDT methods, recommendations for the improvements, and introduction of new candidate NDT technologies, which can be adopted for IC packaging.

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Section: Ndt Methods For Ic Packagingmentioning

confidence: 99%

Section: Ndt Methods For Ic Packagingmentioning

confidence: 99%

Section: Ndt Methods For Ic Packagingmentioning

confidence: 99%

See 1 more Smart Citation

An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection

Aryan

Sampath

Sohn

2018

Sensors

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“…Infrared thermography has been used to inspect flip chips to detect solder joint defects in [56,58,63], missing bumps in [57,59,61], cracks and voids in [60,62].…”

Section: Infrared Thermographymentioning

confidence: 99%

A Survey of Detection Methods for Die Attachment and Wire Bonding Defects in Integrated Circuit Manufacturing

Alam

Kehtarnavaz

2022

IEEE Access

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Defect detection plays a vital role in the manufacturing process of integrated circuits (ICs). Die attachment and wire bonding are two steps of the manufacturing process that determine the power and signal transmission quality and dependability in an IC. This paper presents a survey or literature review of the methods used for detecting these defects based on different sensing modalities used including optical, radiological, acoustical, and infrared thermography. A discussion of the detection methods used is provided in this survey. Both conventional and deep learning approaches for detecting die attachment and wire bonding defects are considered along with challenges and future research directions.INDEX TERMS die attachment and wire bonding defects, defect detection in IC manufacturing, integrated circuit (IC) defects

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“…Although the above control loops introduce some different realization methods of ADPLL and study the performance and locking time of ADPLL, the loop used for induction heating power supply cannot achieve a wide range of frequency sweep and the operating frequency is less than 150 kHz. The frequently used excitation frequency of ECPT [25][26][27][28][29][30] is higher than 150 kHz. This paper presents a resonant frequency tracking loop for full bridge series resonant inverter by switching between DDS and ADPLL.…”

Section: Introductionmentioning

confidence: 99%

Resonant frequency tracking mode on eddy current pulsed thermography non-destructive testing

Miao

Gao

et al. 2020

Phil. Trans. R. Soc. A.

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Eddy current pulsed thermography (ECPT) has been widely used in the field of non-destructive testing due to its safety, non-contact detection, high spatial resolution and intuitive results. Inductive excitation source is an important component of ECPT and provides high-frequency alternating current to drive the excitation coil. However, a resonant frequency distortion phenomenon exists in the excitation source during the detection process, which seriously affects the output power of the excitation source and the sample detection effect. This paper presents a fast resonant frequency tracking loop for full bridge series resonant inverter which is used to search the resonance frequency in real time through direct digital synthesizer (DDS) and all-digital phase-locked loop. Theoretical analysis and simulation are presented to explain the working principle of the loop. Then, an experimental prototype is manufactured which serves as an excitation source for the ECPT experimental system. Compared with traditional excitation sources, the prototype does not need a water-cooled device and the tracking speed can be adjusted by modifying the parameters of DDS. Finally, experiments have been conducted on both artificial slot of 45# steel and natural cracks of rail and stainless steel to investigate the influence of resonant frequency tracking speed on the crack detection. The results revealed that reducing the resonant frequency tracking time can efficiently improve defect detectability and the manufactured prototype showed more application potential. This article is part of the theme issue ‘Advanced electromagnetic non-destructive evaluation and smart monitoring’.

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Thermal Analysis of Solder Joint Based on Eddy Current Pulsed Thermography

Cited by 18 publications

References 21 publications

An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection

An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection

A Survey of Detection Methods for Die Attachment and Wire Bonding Defects in Integrated Circuit Manufacturing

Resonant frequency tracking mode on eddy current pulsed thermography non-destructive testing

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