Thermal analysis of phenylethynyl end-capped fluorinated imide oligomer afr-pepa-4

Li, Y.; Obando, N.; Tschen, Francisco; Morgan, Roger J.

doi:10.1007/s10973-005-7355-7

Cited by 12 publications

(18 citation statements)

References 10 publications

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“…AI‐n0 (repeat unit n = 0) was one component in m ‐AI as shown in GPC curve of Figure 3 and was demonstrated to have crystal phase by XRD in Figure 4. The same phenomenon could be seen for other low‐molecular weight polyimide oligomers 47, 50, 51. After m ‐AI and p ‐AI were cured, m ‐API (cured m ‐AI) and p ‐API (cured p ‐AI) were amorphous as shown in Figure 4.…”

Section: Resultssupporting

confidence: 64%

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Novel acetylene‐terminated polyisoimides with excellent processability and properties comparison with corresponding polyimides

Heng

Liu

Zhang

et al. 2011

J of Applied Polymer Sci

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Two novel acetylene-terminated isoimide oligomers and their corresponding imide oligomers have been synthesized by using trifluoroacetic anhydride or acetic anhydride as dehydrating agent, respectively. Their main structure was confirmed by Fourier transform infrared spectroscopy (FTIR). The isoimide oligomers were amorphous and showed excellent solublility in many common solvents, such as acetone and tetrahydeofuran, whereas the imide oligomers cannot dissolve in them. Differential scanning calorimetry and rheometer were used to study crosslinking behavior and processability of these oligomers. The isoimide oligomers exhibited considerably wider processing window and lower viscosity compared with imide ones. As expected, the isoimide form could be converted to imide form through thermal treatment, which could be demonstrated by FTIR. After the oligomers were cured, the polyisoimides showed similar properties compared with corresponding polyimides. V C 2011 Wiley Periodicals, Inc. J Appl Polym Sci 122: [3493][3494][3495][3496][3497][3498][3499][3500][3501][3502][3503] 2011

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Section: Resultssupporting

confidence: 64%

“…The same phenomenon could be seen for other low-molecular weight polyimide oligomers. 47,50,51 After m-AI and p-AI were cured, m-API (cured m-AI) and p-API (cured p-AI) were amorphous as shown in Figure 4.…”

Section: Processability Of the Imide And Isoimide Oligomersmentioning

confidence: 99%

Novel acetylene‐terminated polyisoimides with excellent processability and properties comparison with corresponding polyimides

Heng

Liu

Zhang

et al. 2011

J of Applied Polymer Sci

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“…Polyimides are a class of high‐temperature polymers that have found use in a variety of applications, from electronics to aerospace, because of their high thermal stability and excellent mechanical, chemical, and electrical properties [1, 2]. In addition, fiber‐reinforced, high‐temperature, polymer‐matrix composites are particularly attractive for aerospace structures because of their low density [2, 3], high mechanical strength [2, 4–10], high modulus [2, 4, 6, 8, 9], thermo‐oxidative stability [2, 4, 9, 11, 12], electrical properties [2, 6, 10, 13], and excellent chemical resistance [2, 5, 6, 14]. Various polyimide‐based composites have been studied for use in aerospace applications for these reasons [2, 4, 6, 11, 15].…”

Section: Introductionmentioning

confidence: 99%

“…Various polyimide‐based composites have been studied for use in aerospace applications for these reasons [2, 4, 6, 11, 15]. Phenylethynyl‐endcapped fluorinated polyimides are especially useful because of their environmental stability and high glass‐transition temperature ( T g ) (435–455°C) [8]. It is this high T g that makes fluorinated polyimides good candidates to withstand the extreme service conditions experienced by military aircraft and reusable space vehicles.…”

Section: Introductionmentioning

confidence: 99%

“…The blister temperature for both materials at these moisture levels is also low (∼315°C) [3, 6]. Both polyimides exhibit good thermal stability, but the T g for PMR‐II‐50 is 363°C and for AFR700B it is near 400°C, whereas the fluorinated polyimide used here is 435–455°C [5, 8, 15, 23]. Because of the enhanced thermal stability of the fluorinated polyimide, both the neat‐resin and its composites exhibit much better resistance to hygrothermal degradation.…”

Section: Introductionmentioning

confidence: 99%

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Blistering in carbon‐fiber‐filled fluorinated polyimide

et al. 2010

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A blistering study was performed on a fluorinated polyimide resin and its carbon-fiber composite in an effort to determine the blister-formation temperature and the influence of blisters on composite performance. The fluorinated resin and carbon-fiber composite exhibit higher glass-transition (435-4558C) and decomposition temperatures (above 5208C) than similar polyimide resins and their carbon-fiber composites currently used. Two techniques were used to determine moisture-induced blister formation. A transverse extensometer with quartz lamps as a heating source measured thickness expansion, as did a thermomechanical analyzer as a function of temperature. Both methods successfully measured the onset of blister formation with varying amounts of absorbed moisture (up to 3 wt%) in the samples. The polyimide resin exhibited blister temperatures ranging from 225 to 3628C, with 1.7-3.0 wt% absorbed moisture, and the polyimide composite had blister temperatures from 246 to 2948C with 0.5-1.5 wt% moisture. The blistering effects of the polyimide composites were found to have little correlation with modulus. POLYM. COMPOS., 32:185-192, 2011. ª

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Thermal degradation of high‐temperature fluorinated polyimide and its carbon fiber composite

Adamczak

Spriggs

Fitch

et al. 2009

J of Applied Polymer Sci

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High-temperature polymers are being used for a broad range of applications, such as composite matrices for structural applications (e.g., high speed aircraft). Polyimides are a special class of polymers that meet the thermal and oxidative stability requirements for high temperature composite aerospace applications. A weight loss study was performed on a fluorinated polyimide resin and its carbon fiber composite in an effort to determine its thermal stability and degradation mechanisms. Experiments were conducted using a preheated oven and thermogravimetric analysis to obtain the weight loss. Regardless of the method used, the resin and composite exhibited excellent thermal stability (less than 1% weight loss) below 430 C, regardless of 2-20 min of exposure. After 20 min of exposure at 510 C, the composite remained relatively stable with only 5.3% weight loss using the oven technique, whereas the neat polyimide sustained 12.6%. When degradation occurred, it was found to be the result of thermolysis and oxidation (to a lesser extent).

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Thermal analysis of phenylethynyl end-capped fluorinated imide oligomer afr-pepa-4

Cited by 12 publications

References 10 publications

Novel acetylene‐terminated polyisoimides with excellent processability and properties comparison with corresponding polyimides

Novel acetylene‐terminated polyisoimides with excellent processability and properties comparison with corresponding polyimides

Blistering in carbon‐fiber‐filled fluorinated polyimide

Thermal degradation of high‐temperature fluorinated polyimide and its carbon fiber composite

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