Thermal analysis of metal-ceramic bonding using finite element method

Abstract

This paper reports a finite element study of effect of bonding strength between metal and ceramic. The bonding strength is evaluated with different processing temperature and holding time. The difference between the coefficients of linear thermal expansion (CTEs) of the metal and ceramic induces thermal stress at the interface. The mismatch thermal stress at the interface region plays an important role in improving bonding strength. Hence, it is essential to evaluate the interface bonding in metal-ceramics joints. The Al/SiC bonding was modeled and analyzed using finite element analysis in ANSYS (v.10). Keywords: Bonding Strength, Coefficient of Thermal Expansion, Thermal Stress, Interface, Al/Sic, FEA.

Thermal Analysis of Dissimilar Materials Diffusion Bonding Using Finite Element Method

“…Over the last four decades, there has been a real need for special purpose structural materials, which can withstand huge load for a long duration at a very high temperature. Concentration of stress at the interface becomes more severe as the free surface's approaches [1][2][3]. Essential problems in solid-state bonding are strength of the bond at interface and thermal stress concentration [4 -5].…”