Thermal analysis of cured halogenated epoxy resins based on bisphenol-C

Kagathara, V.M; Parsania, P. H.

doi:10.1016/s0142-9418(01)00067-8

Cited by 20 publications

(8 citation statements)

References 10 publications

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“…Knowledge of the kinetic parameters associated with thermal degradation constitutes an important tool in estimating the thermal behavior of composites under thermal dynamic conditions. [8][9][10] Dynamic mechanical TA (DMTA) has been widely used as a technique for investigating the structures and dynamic mechanical behavior of composite materials for determining their storage modulus (E 0 ), loss modulus (E 00 ), and loss factor (tan d). [11] One of the most common uses of dynamic mechanical testing is the determination of the glass transition temperature (T g ) of a sample.…”

Section: Introductionmentioning

confidence: 99%

Effect of Bio‐Scavengers on the Curing Behavior and Bonding Properties of Melamine‐Formaldehyde Resins

Kim

et al. 2006

Macro Materials & Eng

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Summary: The effects of bio‐scavengers on the formaldehyde emission, bonding strength, curing behavior, and thermal decomposition properties of MF resins for engineered flooring and adhesion for wood were investigated. Four varieties of bio‐scavengers, tannin powder, wheat flour, rice husk flour, and charcoal, were added to MF resin at 5 wt.‐%. To determine formaldehyde emission and bonding strength, we manufactured engineered floorings. MF‐charcoal was most effective in reducing formaldehyde emission because of its porous nature, but its bonding strength was decreased. Tannin powder and wheat flour, which contain more hydroxyl groups, showed higher bonding strength and curing degree than pure MF resin did. Although the hydroxyl groups of the bio‐scavengers were effective in reducing formaldehyde emission and improve bonding strength and curing degree, rice husk flour and charcoal behaved like inorganic substances, thereby disturbing the adhesion between MF resin and wood and thus reducing the bonding strength. In thermogravimetric analysis, MF‐tannin showed the highest thermal stability in the low‐temperature range from 100 to 300 °C.Storage modulus (E′) of MF resin with various bio‐scavengers at a heating rate of 10 °C · min−1.magnified imageStorage modulus (E′) of MF resin with various bio‐scavengers at a heating rate of 10 °C · min−1.

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Section: Introductionmentioning

confidence: 99%

Effect of Bio‐Scavengers on the Curing Behavior and Bonding Properties of Melamine‐Formaldehyde Resins

Kim

et al. 2006

Macro Materials & Eng

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“…Epoxy resin hardeners and curing technologies have great influence on the properties of cured epoxy resins. There are many reports on curing of different epoxide systems, but the hardeners mainly belong to conventional small molecules, such as 1,2-diamine cyclohexane, 1 maleic anhydride, 2 methyl-tetrahydrophtalic anhydride, 3 etc., among which aliphatic polyamino-hardeners can cure their epoxide systems at room temperature, but they are highly poisonous and their curing systems have short pot life. Polycarboxylic acids and anhydrides pose difficulty in formulating high solid coatings because most of them have high melting point, low solubility in organic solvents, and poor compatibility with coexisting ingredients.…”

Section: Introductionmentioning

confidence: 99%

Curing of DGEBA epoxy resin by low generation amino‐group‐terminated dendrimers

Zhang

Zhu

2006

J of Applied Polymer Sci

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Low generation amino-group-terminated poly(ester-amine) dendrimers PEA1.0 (NH 2 ) 3 and PEA1.5 (NH 2 ) 8 , and poly(amido-amine) dendrimer PAMAM1.0 (NH 2 ) 4 were used as diglycidyl ether of bisphenol A (DGEBA) epoxy resin hardeners. Thermal behavior and curing kinetics of dendrimer/DGEBA systems were investigated by means of differential scanning calorimetry (DSC). Compared with ethylene diamine (EDA)/DGEBA system, the dendrimer/DGEBA systems gradually liberated heat in two stages during the curing process, and the total heat liberated was less. Apparent activation energy and curing reaction rate constants for dendrimer and EDA/DGEBA systems were estimated. Thermal stabilities and mechanical properties of cured thermosetting systems were examined as well.

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“…The phenolic resin which is prepared from epoxy modification of novolac resin is known as epoxidized novolac resin (ENR) and resulted in void‐free thermosets after curing . Epoxy‐functionalized resins with more than 1 epoxy group can be cured using amines, anhydrides, and imidazoles . Interestingly, amine‐functionalized carbon fillers of graphene and CNT were used as the curing and composite agent in the preparation of epoxy‐functionalized resins composites.…”

Section: Introductionmentioning

confidence: 99%

Multifunctional curing component for epoxidized novolac resin by grafting poly (amidoamine) on carbon nanotubes using a divergent method

Pourhosseini‐Pakdel

Roghani‐Mamaqani

Azimi

et al. 2018

Polymers for Advanced Techs

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Poly(amidoamine)-grafted carbon nanotube (CNTD) was synthesized and used as a multi-component curing agent for epoxidized novolac resin (ENR). This composite and curing agent can improve thermal stability of the resin due to its tubular graphitic core and also dendritic amino-functionalities. The ENR was cured in the presence of different amounts of CNTD. Then, the thermal degradation temperature and also char content of the products were compared with the ethylenediamine-cured ENR.Successful functionalization of oxidized carbon nanotubes with poly(amidoamine) was evaluated by Fourier transform infrared spectroscopy, X-ray photoelectron spectroscopy, X-ray diffraction, and thermogravimetric analysis. According to the thermogravimetric analysis results, char content of ethylenediamine-cured ENR is 44.7% which increased to 54.6%, 55.5%, and 56.9% by the addition of 3, 5, and 8 wt% of CNTD into the resin matrix. Also, addition of CNTD content increased thermal stability of the composites. The tubular structure of CNTD was observed by scanning and transmission electron microscopies. KEYWORDS carbon nanotube, epoxidized novolac resin, poly(amidoamine), thermal stability

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Thermal analysis of cured halogenated epoxy resins based on bisphenol-C

Cited by 20 publications

References 10 publications

Effect of Bio‐Scavengers on the Curing Behavior and Bonding Properties of Melamine‐Formaldehyde Resins

Effect of Bio‐Scavengers on the Curing Behavior and Bonding Properties of Melamine‐Formaldehyde Resins

Curing of DGEBA epoxy resin by low generation amino‐group‐terminated dendrimers

Multifunctional curing component for epoxidized novolac resin by grafting poly (amidoamine) on carbon nanotubes using a divergent method

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