Theoretical study on brittle–ductile transition behavior in elliptical ultrasonic assisted grinding of hard brittle materials

Chen, J.B.; Fang, Qihong; Wang, C.C.; Du, Jianke; Liu, F.

doi:10.1016/j.precisioneng.2016.04.005

Cited by 77 publications

(12 citation statements)

References 59 publications

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“…In order to determine the critical cutting depth for the removal of the brittleness and plasticity of a material, a taper-cutting experiment is the main method for effectively assessing the actual cutting thickness of the material—from shallow to deep. It is widely used in the study and realization of the cutting mechanisms of hard and brittle materials, and it is an important part of ultra-precision machining [ 9 , 10 ].…”

Section: Introductionmentioning

confidence: 99%

A Self-Established “Machining-Measurement-Evaluation” Integrated Platform for Taper Cutting Experiments and Applications

Yang

Zhu

et al. 2021

Micromachines

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Taper-cutting experiments are important means of exploring the nano-cutting mechanisms of hard and brittle materials. Under current cutting conditions, the brittle-ductile transition depth (BDTD) of a material can be obtained through a taper-cutting experiment. However, taper-cutting experiments mostly rely on ultra-precision machining tools, which have a low efficiency and high cost, and it is thus difficult to realize in situ measurements. For taper-cut surfaces, three-dimensional microscopy and two-dimensional image calculation methods are generally used to obtain the BDTDs of materials, which have a great degree of subjectivity, leading to low accuracy. In this paper, an integrated system-processing platform is designed and established in order to realize the processing, measurement, and evaluation of taper-cutting experiments on hard and brittle materials. A spectral confocal sensor is introduced to assist in the assembly and adjustment of the workpiece. This system can directly perform taper-cutting experiments rather than using ultra-precision machining tools, and a small white light interference sensor is integrated for in situ measurement of the three-dimensional topography of the cutting surface. A method for the calculation of BDTD is proposed in order to accurately obtain the BDTDs of materials based on three-dimensional data that are supplemented by two-dimensional images. The results show that the cutting effects of the integrated platform on taper cutting have a strong agreement with the effects of ultra-precision machining tools, thus proving the stability and reliability of the integrated platform. The two-dimensional image measurement results show that the proposed measurement method is accurate and feasible. Finally, microstructure arrays were fabricated on the integrated platform as a typical case of a high-precision application.

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Section: Introductionmentioning

confidence: 99%

A Self-Established “Machining-Measurement-Evaluation” Integrated Platform for Taper Cutting Experiments and Applications

Yang

Zhu

et al. 2021

Micromachines

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“…Grinding refers to machining with high-speed abrasive wheels. A wide variety of sizes and types of abrasives are used in this technique [1]. This process requires a substantial amount of power to shear one unit of removal material.…”

Section: Introductionmentioning

confidence: 99%

Application of an Auxiliary Wheel Cleaning System in the Grinding of SPK Tool Steel

Adibi

Hatami

Rezaei

2021

Preprint

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Grinding operation is one of the most complex and accurate machining processes whose performance is highly dependent on the surface conditions of the grinding wheel. As the friction between abrasive grains and the workpiece results in a large amount of heat, the use of coolant can prevent the workpiece surface from burning, microstructure alteration, subsurface damages, and hardness variation. To get better the cleaning of the abrasive grains on the surface of the wheel during the grinding process, this paper is focused on the performance of an auxiliary compressed air jet system during grinding of hard-to-grind materials. Moreover, the wheel loading of the grinding wheel will also be evaluated. Different incident angles of the compressed air nozzle (0˚, 30˚, 45˚, and 60˚) were examined. Furthermore, conventional flood coolant, as well as drying with and without a cleaning system, was applied for comparison purposes. Surface roughness, tangential forces, specific energy, wheel loading analysis, and SEM images were evaluated where the incident angle of 45˚ led to the best results. Wheel loading resulted in the accumulation of chips between abrasive grains to the top of cutting grains. Detection and identification of loading has been operated based on image processing technique.

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“…It is well known that brittle materials undergo a transition of cutting mode from brittle to ductile when the machining scale decreases to be small enough, which is referred to as brittle-ductile cutting mode transition (BDCMT) [1,2,3]. This phenomenon has been extensively studied, e.g., its mechanisms [4,5,6], how it is affected by machining conditions [7,8,9,10], etc., due to its vital importance for achieving super smooth surfaces in ultra-precision machining of brittle materials [11].…”

Section: Introductionmentioning

confidence: 99%

Mechanism of Unstable Material Removal Modes in Micro Cutting of Silicon Carbide

2019

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This study conducts large-scale molecular dynamics (MD) simulations of micro cutting of single crystal 6H silicon carbide (SiC) with up to 19 million atoms to investigate the mechanism of unstable material removal modes within the transitional range of undeformed chip thickness in which either brittle or ductile mode of cutting might occur. Under this transitional range, cracks are always formed in the cutting zone, but the stress states cannot guarantee their propagation. The cutting mode is brittle when the cracks can propagate and otherwise ductile mode cutting happens. Plunge cutting experiment is conducted to produce a taper groove on a 6H SiC wafer. There is a transitional zone between the brittle-cut and ductile-cut regions, which has a mostly smooth surface with a few brittle craters on it. This study contributes to the understanding of the detailed process of brittle-ductile cutting mode transition (BDCMT) as it shows that a transitional range can occur even for single crystals without internal defects and provides guidance for the determination of tcritical from taper grooves made by various techniques, e.g., to adopt larger tcritical around the end of the transitional range to increase machining efficiency for grinding or turning as long as the cracks do not extend below the machined surface.

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Theoretical study on brittle–ductile transition behavior in elliptical ultrasonic assisted grinding of hard brittle materials

Cited by 77 publications

References 59 publications

A Self-Established “Machining-Measurement-Evaluation” Integrated Platform for Taper Cutting Experiments and Applications

A Self-Established “Machining-Measurement-Evaluation” Integrated Platform for Taper Cutting Experiments and Applications

Application of an Auxiliary Wheel Cleaning System in the Grinding of SPK Tool Steel

Mechanism of Unstable Material Removal Modes in Micro Cutting of Silicon Carbide

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