2023
DOI: 10.1016/j.physb.2022.414632
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Theoretical study on adsorption structures and electrical properties of Cu (110) with [Cu(μ-HCOO) (OH)2]2

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Cited by 5 publications
(2 citation statements)
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“…The coupling with the metal is considered by incorporating the Green function g s ( E ) of the metal substrate in the equation of motion of the Green functions. The imaginary part of g s ( E ) is numerically calculated from the LDOS of the Cu(110) surface, qualitatively estimated from ref . It is represented by the black curve of Figure .…”
Section: Modelmentioning
confidence: 99%
“…The coupling with the metal is considered by incorporating the Green function g s ( E ) of the metal substrate in the equation of motion of the Green functions. The imaginary part of g s ( E ) is numerically calculated from the LDOS of the Cu(110) surface, qualitatively estimated from ref . It is represented by the black curve of Figure .…”
Section: Modelmentioning
confidence: 99%
“…[13,26,27] This is attributed to the dense self-assembly layer of the carboxyl group from formic acid on the copper surface, leading to the creation of a protective antioxidant film layer. [28,29] Consequently, this layer impedes the adsorption of oxygen or chloride ions onto the metallic copper surface, thereby enhancing its resistance to corrosion. [26,[30][31][32][33][34] Thioglycolic acid (TGA) [35][36][37][38][39][40][41] was expected to have better adsorption stability on copper surfaces because the molecule contains both sulfhydryl group and carboxyl groups.…”
Section: Introductionmentioning
confidence: 99%