“…We carefully summarize current progress on materials, structures, properties, and applications of both commercial and new‐type TECs in this chapter. [ 11–13,16–18,20,22,23,25–27,30,32,33,35,36,38,40,52,53,56,57,61,62,73,102–115 ]…”
Section: Fabrication and Performance Of Tecmentioning
confidence: 99%
“…[ 83–94 ] Timelines for c) maximum cooling performance Δ T max and d) maximum COP (COP max ) of TECs based on bulk, film, and superlattice materials. [ 11–13,16–18,20,22,23,25–27,30,32,33,35,36,38,40,52,53,56,57,61,62,73,102–115 ]…”
Owing to the free of noise, mechanical component, working fluid, and chemical reaction, thermoelectric cooling is regarded as a suitable solution to address the greenhouse emission for the broad cooling scenarios. Here, the significant progress of state‐of‐the‐art thermoelectric coolers is comprehensively summarized and the related aspects of materials, fundamental design, heat sinks, and structures, are overviewed. Particularly, the usage of thermoelectric coolers in smart city, greenhouse, and personal and chip thermal management is highlighted. In the end, current challenges and future opportunities for further improvement of designs, performance, and applications of thermoelectric coolers are pointed out.
“…We carefully summarize current progress on materials, structures, properties, and applications of both commercial and new‐type TECs in this chapter. [ 11–13,16–18,20,22,23,25–27,30,32,33,35,36,38,40,52,53,56,57,61,62,73,102–115 ]…”
Section: Fabrication and Performance Of Tecmentioning
confidence: 99%
“…[ 83–94 ] Timelines for c) maximum cooling performance Δ T max and d) maximum COP (COP max ) of TECs based on bulk, film, and superlattice materials. [ 11–13,16–18,20,22,23,25–27,30,32,33,35,36,38,40,52,53,56,57,61,62,73,102–115 ]…”
Owing to the free of noise, mechanical component, working fluid, and chemical reaction, thermoelectric cooling is regarded as a suitable solution to address the greenhouse emission for the broad cooling scenarios. Here, the significant progress of state‐of‐the‐art thermoelectric coolers is comprehensively summarized and the related aspects of materials, fundamental design, heat sinks, and structures, are overviewed. Particularly, the usage of thermoelectric coolers in smart city, greenhouse, and personal and chip thermal management is highlighted. In the end, current challenges and future opportunities for further improvement of designs, performance, and applications of thermoelectric coolers are pointed out.
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