Theoretical analysis and simulation of micromachined THz waveguide embedded in LTCC multi-layer packaging substrate for high throughput data exchange backbone and vacuum electronic devices applications
Abstract:Micromachined waveguides embedded in LTCC (Low Temperature Co-fired Ceramic) multi-layer packaging substrate are excellent candidates for vacuum microelectronic devices in submillimeter wave or terahertz band, and data exchange backbone structures with high data throughput capabilities in highly integrated system-in-package (SIP). In this paper, theoretical and numerical simulation on the fundamental characteristics of a folded waveguide (FWG) and a directional coupler of ridge waveguide in terahertz band are … Show more
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