The wetting, reaction and bonding of silicon nitride by Cu-Ti alloys

Kim, Do-Hyung; Hwang, Seonhong; Chun, Soung Soon

doi:10.1007/bf01124666

Cited by 33 publications

(6 citation statements)

References 17 publications

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“…With a negative ⌬G s value, the segregation of sion of the smaller and faster ion in the film has also been observed in the growth of TiN film from a silicon nitride the solute to the interfaces between two different phases decreases with an increase in temperature, which is consissubstrate. [35] With the diffusion of carbon through the TiC layer as the rate-controlling step, the excess Ti (and Sn) tent with the result shown in the previous section of this report. In fact, there are corresponding decreases in interfaatoms that diffuse to the growth front of the TiC layer thus gradually accumulate near the interfaces between the braze cial energies for the preferential segregation of solute to an interface.…”

Section: Discussionsupporting

confidence: 76%

Interfacial segregation of Ti in the brazing of diamond grits onto a steel substrate using a Cu-Sn-Ti brazing alloy

Lin

Liang

2002

Metall Mater Trans A

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Diamond grits were brazed onto a steel substrate using a prealloyed Cu-10Sn-15Ti (wt pct) brazing alloy at 925 ЊC and 1050 ЊC. Due to the relatively high concentration of Ti in the brazing alloy, the braze matrix exhibited a composite structure, composed of ␤ -(Cu,Sn), a Cu-based solid solution, and various intermetallic compounds with different morphologies. The reaction of Ti with diamond yielded a continuous TiC layer on the surfaces of the diamond grits. On top of the TiC growth front, an intermetallic compound, composed of Sn and Ti, nucleated and grew into a randomly interwoven fine lacey structure. An interfacial structure developed as the interwoven fine lacey phase was semicoherently bonded to the TiC layer, with the Cu-based braze matrix filling its interstices. The thickness of such a composite layer was increased linearly with the square root of isothermal holding time at 925 ЊC, complying with the law of a diffusion-controlled process. However, at 1050 ЊC, the segregation behavior of Ti and Sn to the interfaces between the TiC layer and the braze matrix diminished, due to the increased solubility of Ti in the Cu-based liquid phase. The enhanced dissolution of Ti in the Cu-based liquid phase at 1050 ЊC also caused the precipitation of rod-like CuTi with an average diameter of about 0.2 m during cooling. SnTi 3 was the predominant intermetallic compound and existed in three different forms in the braze matrix. It existed as interconnected grains of large size which either floated to the surface of the braze matrix or grew into faceted grains. It also exhibited a nail-like structure with a mean diameter of about 1 m for the rod section and a lamellar structure arising from a eutectic reaction during cooling.

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Section: Discussionsupporting

confidence: 76%

Interfacial segregation of Ti in the brazing of diamond grits onto a steel substrate using a Cu-Sn-Ti brazing alloy

Lin

Liang

2002

Metall Mater Trans A

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“…nism is further hindered by a lack of experimental data. The interfacial reactions and the spreading kinetics are very rapid, 11,18,19,29,40,77,82,[87][88][89][90][91][92] making the collection of spreading kinetics and reaction-rate data challenging. Typical spreading data for copper-titanium alloys on alumina are shown in Figure 5.…”

Section: The Wetting and Spreading Of Liquid Metals On Ceramic Substrmentioning

confidence: 99%

“…It has been observed that the strength of a brazed joint decreases with increasing reaction product thickness. 21,78,82 Since interfacial product thickening is also occurring during the wetting and spreading process, the spreading kinetics is needed to predict the minimum time required for spreading so that the time for reaction product thickening can be minimized. Theoretically modeling the spreading kinetics is complex.…”

Section: The Wetting and Spreading Of Liquid Metals On Ceramic Substrmentioning

confidence: 99%

Ceramic-metal interfaces and the spreading of reactive liquids

Meier

Javernick²,

Edwards³

1999

JOM

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“…The wettability increases, in both cases, with the increase of brazing temperature. The best shear strength results were attained for 316/CB4/Al 2 O 3 joints produced at 850 • C. Moreover, it is evident in different works [18][19][20] that the highest wettability rate does not assures the best mechanical behaviour. Analysing the CB5 shear strength results at 900 and 950 • C one can easily see that those values are higher than the results obtained with CB4.…”

Section: Microstructuresmentioning

confidence: 85%

Microstructure, mechanical properties and chemical degradation of brazed AISI 316 stainless steel/alumina systems

Paiva¹,

Barbosa

2008

Materials Science and Engineering: A

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The main aims of the present study are simultaneously to relate the brazing parameters with: (i) the correspondent interfacial microstructure, (ii) the resultant mechanical properties and (iii) the electrochemical degradation behaviour of AISI 316 stainless steel/alumina brazed joints. Filler metals on such as Ag-26.5Cu-3Ti and Ag-34.5Cu-1.5Ti were used to produce the joints. Three different brazing temperatures (850, 900 and 950 • C), keeping a constant holding time of 20 min, were tested. The objective was to understand the influence of the brazing temperature on the final microstructure and properties of the joints. The mechanical properties of the metal/ceramic (M/C) joints were assessed from bond strength tests carried out using a shear solicitation loading scheme. The fracture surfaces were studied both morphologically and structurally using scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS) and X-ray diffraction analysis (XRD). The degradation behaviour of the M/C joints was assessed by means of electrochemical techniques.It was found that using a Ag-26.5Cu-3Ti brazing alloy and a brazing temperature of 850 • C, produces the best results in terms of bond strength, 234 ± 18 MPa. The mechanical properties obtained could be explained on the basis of the different compounds identified on the fracture surfaces by XRD. On the other hand, the use of the Ag-34.5Cu-1.5Ti brazing alloy and a brazing temperature of 850 • C produces the best results in terms of corrosion rates (lower corrosion current density), 0.76 ± 0.21 Acm −2 . Nevertheless, the joints produced at 850 • C using a Ag-26.5Cu-3Ti brazing alloy present the best compromise between mechanical properties and degradation behaviour, 234 ± 18 MPa and 1.26 ± 0.58 Acm −2 , respectively. The role of Ti diffusion is fundamental in terms of the final value achieved for the M/C bond strength. On the contrary, the Ag and Cu distribution along the brazed interface seem to play the most relevant role in the metal/ceramic joints electrochemical performance.

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The wetting, reaction and bonding of silicon nitride by Cu-Ti alloys

Cited by 33 publications

References 17 publications

Interfacial segregation of Ti in the brazing of diamond grits onto a steel substrate using a Cu-Sn-Ti brazing alloy

Interfacial segregation of Ti in the brazing of diamond grits onto a steel substrate using a Cu-Sn-Ti brazing alloy

Ceramic-metal interfaces and the spreading of reactive liquids

Microstructure, mechanical properties and chemical degradation of brazed AISI 316 stainless steel/alumina systems

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