The variation of resistance of gold films with time and annealing procedure

Dorey, A.P.; Knight, John M.

doi:10.1016/0040-6090(69)90093-5

Cited by 23 publications

(7 citation statements)

References 6 publications

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“…where D is the vacancy diffusivity and t is time, sub- From Eq. [2] and [3], the vacancy concentration, Cx (x, t), can be easily shown to be…”

Section: Theoretical Modelmentioning

confidence: 99%

“…Qn : (On2D 4-k)t [7] Determination of k The second term on the left-hand side of Eq. [2], kC~, represents the rate of the vacancy annihilation, which takes place at preexisting voids. This relation can then be expressed as kC~ = Ja4~aeNv [8] where Ja is the vacancy flux at a void surface, a the void radius, and Nv the void density.…”

mentioning

confidence: 99%

“…[2]) are not independent of each other, but are constrained by the requirement that the concentration from Eq. [2] averaged over the film thickness, Cx, must be the same as the concentration from Eq. [9] averaged over the Wigner-Seitz cell at any given time.…”

mentioning

confidence: 99%

“…Equation [2] together with Eq. [15] and [16] can be integrated numerically over small increments of time, using an iteration method in a self-consistent manner with the aid of a digital computer.…”

mentioning

confidence: 99%

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On the Diffusion of Excess Vacancies to Free Surfaces and Voids in Thin Films

Lloyd

Nakahara

1978

J. Electrochem. Soc.

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Recent investigations have,shown that resistivity decay in evaporated gold films originates, in part, from the annihilation of excess vacancies, trapped during film condensation, at a high density (1015-1{~17/cm 8) of small (~50A) voids present within the film. This paper presents a theoretical treatment of vacancy diffusion to free surfaces and to voids. The treatment predicts both the observed void growth and resistivity decay in thin films.It is well known that the resistivity of freshly deposited thin films changes continuously with time at room temperature (1-3). It has been generally accepted that resistivity decay in thin films takes place as a result of the diffusion of excess vacancies, quenched-in during film formation, to sinks such as free surfaces and grain boundaries (1, 3). Recent transmission-electron-microscope (TEM) studies of evaporated gold films have shown that thin films generally contain a high density (~1016/cm 3) of small voids (4, 5). The presence of such a high density of voids suggests that these voids may serve as potential sites for the annihilation of excess vacancies. Experimental 'evidence for this suggestion has been found in our recent observations that these voids grow at the expense of excess vacancies with aging time even at room temperature (6, 7). Assuming that voids are the only sinks for excess vacancies, Lloyd and Nakahara (6) were able to relate, semiquantitatively, the void growth to the resistivity decay in evaporated gold films. Although the effect of the surfaces was not considered, this treatment was in good agreement with experiments for long times following film deposition, but could not account for short-term resistivity decay. We have, therefore, treated our earlier problem by using a more rigorous mathematical framework which considers both surfaces and voids as potential sinks for excess vacancies.

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“…where D is the vacancy diffusivity and t is time, sub- From Eq. [2] and [3], the vacancy concentration, Cx (x, t), can be easily shown to be…”

Section: Theoretical Modelmentioning

confidence: 99%

mentioning

confidence: 99%

mentioning

confidence: 99%

mentioning

confidence: 99%

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On the Diffusion of Excess Vacancies to Free Surfaces and Voids in Thin Films

Lloyd

Nakahara

1978

J. Electrochem. Soc.

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“…The temperature sensor SenGR1 showed annealing effects during the first and second tempering processes, [ 35 ] as reflected in a significant decrease in resistance at high temperatures (Figure S9c, Supporting Information). To characterize this behavior in detail, five cycles in which the temperature was varied from 23 to 98 °C were performed after curing of the epoxy (Figure 5f).…”

Section: Resultsmentioning

confidence: 99%

iSens: A Fiber‐Based, Highly Permeable and Imperceptible Sensor Design

et al. 2021

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Embedded sensors are key to optimizing processes and products; they collect data that allow time, energy, and materials to be saved, thereby reducing costs. After production, they remain in place and are used to monitor the long‐term structural health of buildings or aircraft. Fueled by climate change, sustainable construction materials such as wood and fiber composites are gaining importance. Current sensors are not optimized for use with these materials and often act as defects that cause catastrophic failures. Here, flexible, highly permeable, and imperceptible sensors (iSens) are introduced that integrate seamlessly into a component. Their porous substrates are readily infused with adhesives and withstand harsh conditions. In situ resistive temperature measurements and capacitive sensing allows monitoring of adhesives curing as used in wooden structures and fiber composites. The devices also act as heating elements to reduce the hardening time of the glue. Results are analyzed using numerical simulations and theoretical analysis. The suggested iSens technology is widely applicable and represents a step towards realizing the Internet of Things for construction materials.

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A comparison of polymer substrates for photolithographic processing of flexible bioelectronics

Simon

Ware

Marcotte

et al. 2013

Biomed Microdevices

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Flexible bioelectronics encompass a new generation of sensing devices, in which controlled interactions with tissue enhance understanding of biological processes in vivo. However, the fabrication of such thin film electronics with photolithographic processes remains a challenge for many biocompatible polymers. Recently, two shape memory polymer (SMP) systems, based on acrylate and thiol-ene/acrylate networks, were designed as substrates for softening neural interfaces with glass transitions above body temperature (37 °C) such that the materials are stiff for insertion into soft tissue and soften through low moisture absorption in physiological conditions. These two substrates, acrylate and thiol-ene/acrylate SMPs, are compared to polyethylene naphthalate, polycarbonate, polyimide, and polydimethylsiloxane, which have been widely used in flexible electronics research and industry. These six substrates are compared via dynamic mechanical analysis (DMA), thermogravimetric analysis (TGA), and swelling studies. The integrity of gold and chromium/gold thin films on SMP substrates are evaluated with optical profilometry and electrical measurements as a function of processing temperature above, below and through the glass transition temperature. The effects of crosslink density, adhesion and cure stress are shown to play a critical role in the stability of these thin film materials, and a guide for the future design of responsive polymeric materials suitable for neural interfaces is proposed. Finally, neural interfaces fabricated on thiol-ene/acrylate substrates demonstrate long-term fidelity through both in vitro impedance spectroscopy and the recording of driven local field potentials for 8 weeks in the auditory cortex of laboratory rats.

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The variation of resistance of gold films with time and annealing procedure

Cited by 23 publications

References 6 publications

On the Diffusion of Excess Vacancies to Free Surfaces and Voids in Thin Films

On the Diffusion of Excess Vacancies to Free Surfaces and Voids in Thin Films

iSens: A Fiber‐Based, Highly Permeable and Imperceptible Sensor Design

A comparison of polymer substrates for photolithographic processing of flexible bioelectronics

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