The creep behavior in pure aluminum has been investigated by helicoid spring creep tests at strain rates, _ " ", lower than 10 À10 s À1 and low temperature ranging from 0:32T m to 0:43T m . It was found that the creep behavior in this region depends strongly on grain sizes and impurity concentrations. For high-purity aluminum (5 N Al) with an average grain size, d g > 1600 mm, nearly the wire diameter of the spring sample, where the role of grain boundary during creep deformation can be negligible, the stress exponent was n $ 5 and the activation energy was Q c ¼ 32 kJ/mol. Microstructural observation showed the formation of large dislocation cells ($10 mm) and tangled dislocations at the cell walls. For high-purity aluminum (5 N Al) with d g ¼ 24 mm, the stress exponent was n $ 1 and the activation energy was Q c ¼ 15 kJ/mol. On the other hand, for commercial low-purity aluminum (2 N Al) with d g ¼ 25 mm, the stress exponent was n ¼ 2 and the activation energy was Q c ¼ 25 kJ/mol. Microstructural observations revealed dislocations emitted from grain boundaries, those dislocations interacting with intragranular dislocations and the formation of dislocation cells in the grains. Based on those experimental results, the low-temperature creep mechanisms in pure aluminum at _ " " < 10 À10 s À1 have been discussed.