The use of heat pipes in personal computers

Xie, Hong; Ali, Atif; Bhatia, R.

doi:10.1109/itherm.1998.689600

Cited by 30 publications

(14 citation statements)

References 2 publications

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“…Initially Tuckerman et al proposed microchannel heat sinks fabricated onto the back of a silicon chip substrate [12]. Later on, other means were employed to cool the chips by: immersing the electronic chips in a pool of inert dielectric liquid [1], thermosyphons, where a liquid evaporates with applied heat and condenses dissipating that heat elsewhere, in a closed system [6], and heat pipes, where the liquid evaporates, condenses at another region and reaches the hot area through wick structures that line the heat pipes thus ensuring uniform distribution of heat [14]. These techniques are inherently unsuitable for compact, embedded systems.…”

Section: Related Prior Workmentioning

confidence: 99%

Cooling of integrated circuits using droplet-based microfluidics

Pamula¹,

Chakrabarty²

2003

Proceedings of the 13th ACM Great Lakes Symposium on VLSI - GLSVLSI '03

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Decreasing feature sizes and increasing package densities are making thermal issues extremely important in IC design. Uneven thermal maps and hot spots in ICs cause physical stress and performance degradation. Many MEMS and microfluidics-based solutions were proposed in the past. We present a cooling method based on high-speed electrowetting manipulation of discrete submicroliter droplets under voltage control with volume flow rates in excess of 10 mL/min. We also propose a flow-rate feedback control where the hot areas get increased supply of droplets without the need for external sensors and electrothermocapillary control where hot areas attract droplets due to thermocapillarity and are returned to their reservoirs by electrowetting resulting in a self-contained and a self-regulated system.

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Section: Related Prior Workmentioning

confidence: 99%

Cooling of integrated circuits using droplet-based microfluidics

Pamula¹,

Chakrabarty²

2003

Proceedings of the 13th ACM Great Lakes Symposium on VLSI - GLSVLSI '03

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“…The conventional methods such as air-cooling, heat pipes, vapour chambers, jet impingement, and thermoelectric cooling [4][5][6][7][8][9] seem to have reached their practical limits creating the need for new cooling techniques. For power dissipation by heat fluxes above 1 MW/m 2 , liquid immersion and liquid cooling using microchannel cooling device are the most suitable [10].…”

Section: Introductionmentioning

confidence: 99%

Numerical Study on the Performance of Double Layer Microchannel with Liquid Gallium and Water

Sharma

Garg

Singh

et al. 2013

Advances in Mechanical Engineering

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The performance of liquid gallium and water in the double layer microchannel has been analysed using three-dimensional conjugate heat transfer analysis. The effect of flow rate on the counter and parallel arrangement of each fluid is studied for three different lengths. Furthermore, cooling capability of liquid gallium and water is compared at the same length with flow rate and pumping power as governing parameters. The performance of fluid was judged on the basis of maximum temperature attained and minimal temperature variations at the heated region. Interesting results have been found showing the effect of specific heat on the type of arrangement for liquid gallium with similar observation for water for low Reynolds number and relatively longer length. Among liquid gallium and water, above certain pumping power use of liquid gallium is found to be favourable for a shorter length of the double layer microchannel. Furthermore, the range of flow rate and pumping power showing superior performance with water was found to increase with the length.

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“…Due to high heat transport capability, passive heat pipes (Chang et al, 2008;Lee et al, 2007;Xie et al, 1998) have been used widely to address the cooling needs in many applications, such as laptops and high-powered desktop computers. Because the conventional heat pipe utilizes capillary force to pump the working fluid from the condenser to the evaporator, the capillary flow has the limitation that prevents handling high heat flux applications such as radar or laser die cooling.…”

Section: Introductionmentioning

confidence: 99%

An Experimental Investigation of Hybrid Oscillating Heat Pipe

Smoot¹,

2011

Frontiers in Heat Pipes

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A novel oscillating heat pipe (OHP) has been constructed and experimentally investigated featuring a meandering channel formed entirely by a wicking structure. The hybrid approach utilizes the wicking structure found in traditional heat pipes, while also utilizing the meandering channels and plug flow of OHPs. Water and acetone were both tested with acetone demonstrating higher peak performance and water demonstrating a wider operating range. While OHPs typically require a high startup power, the hybrid approach presented achieves startup at very low power input and demonstrates a significant improvement in performance over the same device without any working fluid.

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The use of heat pipes in personal computers

Cited by 30 publications

References 2 publications

Cooling of integrated circuits using droplet-based microfluidics

Cooling of integrated circuits using droplet-based microfluidics

Numerical Study on the Performance of Double Layer Microchannel with Liquid Gallium and Water

An Experimental Investigation of Hybrid Oscillating Heat Pipe

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