2008
DOI: 10.1016/j.mseb.2008.09.036
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The use of extended-defect dissolution as a probe for stress-induced interstitial diffusion anisotropy

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Cited by 5 publications
(2 citation statements)
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“…A number of investigations have addressed point defects and their diffusion characteristics in well-ordered or amorphous bulk materials [11,12]. In fact, point defects, such as vacancies and interstitials, are known to have a Contents lists available at ScienceDirect journal homepage: www.elsevier.com/locate/mssp Materials Science in Semiconductor Processing great influence on various structural, mechanical, electrical and optical properties of crystalline and amorphous materials.…”
Section: Introductionmentioning
confidence: 99%
“…A number of investigations have addressed point defects and their diffusion characteristics in well-ordered or amorphous bulk materials [11,12]. In fact, point defects, such as vacancies and interstitials, are known to have a Contents lists available at ScienceDirect journal homepage: www.elsevier.com/locate/mssp Materials Science in Semiconductor Processing great influence on various structural, mechanical, electrical and optical properties of crystalline and amorphous materials.…”
Section: Introductionmentioning
confidence: 99%
“…First, the irradiation-induced normal tensile strain that develops in the first irradiation stage, and/or the stress induced by the curvature of the Si substrate after its amorphization close to the GO/Si interface could lead to anisotropic defect mobility (see e.g. [44] and references therein), with an enhanced migration along the surface normal. Second, a chemical gradient due to intermixing at the GO-Si interface on the one hand and stoichiometric GO at the layer surface on the other hand, could also lead to defect migration along the surface normal [45].…”
mentioning
confidence: 99%