The thermal conductivity of defected copper at finite temperatures

Ye, X. B.; He, Zhouyi; Pan, Bicai

doi:10.1007/s10853-019-04267-0

Cited by 3 publications

(5 citation statements)

References 46 publications

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“…The decrease in TC of the Al matrix is reasonable in practice. Ye et al [ 30 ] found that the TC of Cu declines linearly with the increasing tensile strain of Cu. The decrease in electrical conductivity of metals due to plastic strain has also been reported.…”

Section: Resultsmentioning

confidence: 99%

Thermal Conductivity Stability of Interfacial in Situ Al4C3 Engineered Diamond/Al Composites Subjected to Thermal Cycling

Hao

Zhang

et al. 2022

Materials

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The stability of the thermal properties of diamond/Al composites during thermal cycling is crucial to their thermal management applications. In this study, we realize a well-bonded interface in diamond/Al composites by interfacial in situ Al4C3 engineering. As a result, the excellent stability of thermal conductivity in the diamond/Al composites is presented after 200 thermal cycles from 218 to 423 K. The thermal conductivity is decreased by only 2–5%, mainly in the first 50–100 thermal cycles. The reduction of thermal conductivity is ascribed to the residual plastic strain in the Al matrix after thermal cycling. Significantly, the 272 μm-diamond/Al composite maintains a thermal conductivity over 700 W m−1 K−1 after 200 thermal cycles, much higher than the reported values. The discrete in situ Al4C3 phase strengthens the diamond/Al interface and reduces the thermal stress during thermal cycling, which is responsible for the high thermal conductivity stability in the composites. The diamond/Al composites show a promising prospect for electronic packaging applications.

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Section: Resultsmentioning

confidence: 99%

Thermal Conductivity Stability of Interfacial in Situ Al4C3 Engineered Diamond/Al Composites Subjected to Thermal Cycling

Hao

Zhang

et al. 2022

Materials

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“…It is known from the literature that impurities like foreign elements or precipitations have an influence on the electrical conductivity of metals [24]. Any disturbance of the atomic lattice like point defects on the main or on the sub-lattice changes the band structure of the metal and, therefore, the properties of the electron transport.…”

Section: Resultsmentioning

confidence: 99%

“…Several publications [24,25] describe the effect of metallic impurities on the electrical conductivity of Cu. The strength of the effect on the conductivity depends strongly on the kind of element [25].…”

Section: Resultsmentioning

confidence: 99%

“…However, the oxygen concentration differs a lot: 2070 mg/kg in the initial powder and only 66 mg/kg in the sintered sample. Several publications [24,25] describe the effect of metallic impurities on the electrical conductivity of Cu. The strength of the effect on the conductivity depends strongly on the kind of element [25].…”

Section: Influence Of Impurities On the Heat Conductivitymentioning

confidence: 99%

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Influence of porosity and impurities on the thermal conductivity of pressure-less sintered Cu powder green bodies

et al. 2021

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Copper as a material with a high electrical and thermal conductivity awakes large interest for many applications in industry, e.g. thermal management of electronic components. Powderbased manufacturing techniques (e.g. Selective Laser Melting, Binder Jetting, Fused Filament Fabrication and Metal Injection Molding) enable the complex shaping of metals. Especially the methods without melting processes like Binder Jetting, Fused Filament Fabrication and Metal Injection Molding have a great potential for complex Cu structures. These techniques built up a powder-based green body and require a subsequent sintering step to reach a high density with maximum properties. This work reports the development of the heat conductivity during pressure-less sintering of Cu powder green bodies. The experimental results are compared to analytical models and a numerical simulation and show the limits of the reachable heat conductivity depending on the remaining porosity and the impurity concentration.

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“…The hypervapotron [ 122 , 137 , 138 , 139 , 140 , 141 , 142 ] is a device which can mitigate the effect of heat flux up to 20–30 MW/m 2 on the entire structure of the fusion reactor. Copper alloy acts as a heat sink [ 143 , 144 , 145 , 146 , 147 , 148 ] while austenitic stainless steel plays its role as a structural component [ 123 , 149 , 150 , 151 , 152 , 153 ]. Hence, sustainable joining technology for the mentioned application is necessary.…”

Section: Solid-state Welding Of Copper/stainless Steel Bimetallic Jointmentioning

confidence: 99%

The Joining of Copper to Stainless Steel by Solid-State Welding Processes: A Review

et al. 2022

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Joining immiscible materials such as copper and stainless steel together is a significant concern due to distinct mechanical and metallurgical properties across the joint line, such as melting points, the coefficient of linear thermal expansion, and thermal conductivity. The joint properties of copper to stainless steel welds are in great demand for various mechanical components of the international thermonuclear experimental reactor, ultra-high vacuum system, plan wave linear-accelerator or linac structure, and heat exchanger. These dissimilar-metals joints offer excellent flexibility in design and production, leading to a robust structure for many cutting-edge applications. Hence, the present article reviews the copper to stainless steel joining mechanism under different solid-state processing conditions. The present understanding says that defect-free strong joints between the dissimilar metals are systematically possible. Apart from this understanding, the authors have identified and highlighted the gaps in the research exploration to date. Moreover, a sustainable methodology to achieve a desirable weld of copper to stainless steel depends on favorable processing conditions.

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The thermal conductivity of defected copper at finite temperatures

Cited by 3 publications

References 46 publications

Thermal Conductivity Stability of Interfacial in Situ Al4C3 Engineered Diamond/Al Composites Subjected to Thermal Cycling

Thermal Conductivity Stability of Interfacial in Situ Al4C3 Engineered Diamond/Al Composites Subjected to Thermal Cycling

Influence of porosity and impurities on the thermal conductivity of pressure-less sintered Cu powder green bodies

The Joining of Copper to Stainless Steel by Solid-State Welding Processes: A Review

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