1974
DOI: 10.1016/0039-6028(74)90166-6
|View full text |Cite
|
Sign up to set email alerts
|

The thermal accommodation of helium and argon on a tungsten wire, deduced from the heat lost by the wire

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

0
5
0

Year Published

1975
1975
2022
2022

Publication Types

Select...
6
1

Relationship

0
7

Authors

Journals

citations
Cited by 9 publications
(5 citation statements)
references
References 5 publications
0
5
0
Order By: Relevance
“…Energy accommodation in collisions of argon with surfaces is expected to be reasonably efficient. For example, the accommodation coefficient for Ar colliding with a heated tungsten surface is ∼0.25, and it should be larger for collisions with ZnS because the surface atom masses are lower . From the perspective of the as-trapped NPs, collisions would be with the ligand layer, and based on scattering measurements for Ar from organic surfaces, , c A for 300 K Ar should be close to unity.…”
Section: Resultsmentioning
confidence: 99%
“…Energy accommodation in collisions of argon with surfaces is expected to be reasonably efficient. For example, the accommodation coefficient for Ar colliding with a heated tungsten surface is ∼0.25, and it should be larger for collisions with ZnS because the surface atom masses are lower . From the perspective of the as-trapped NPs, collisions would be with the ligand layer, and based on scattering measurements for Ar from organic surfaces, , c A for 300 K Ar should be close to unity.…”
Section: Resultsmentioning
confidence: 99%
“…40 The accommodation coefficient accounts for the inelasticity of the Ar surface collisions, where Accom = 1 corresponds to collisions where the scattered argon is thermal at T QD and Accom = 0 means no cooling. For a noble gas, Ar is a reasonably efficient collider, with, for example, Accom = 0.24 in collisions with a tungsten filament between 1073 and 1785 K. 41 For 1 mTorr of Ar at 300 K, there would be ∼450 000 collisions per second with a single QD and roughly double that for a QD dimer, assuming that the QDs in the dimer remain unfused, which is probably a reasonable assumption for low temperatures. If we assume Accom = 0.24, then the collisional cooling power equals the laser heat deposition rate at T QD = ∼630 K. This is certainly (see below) well below the temperature where thermal electron or photon emission would be expected and thus seems reasonable.…”
Section: Discussionmentioning
confidence: 99%
“…The accommodation coefficient a is discussed scarcely anywhere in the literature, probably because it is not easy to measure or calculate it. Almost all available publications [37][38][39][40] consider accommodation coefficients of noble gases or H 2 and O 2 on a tungsten surface. In ref.…”
Section: To Simulate Collisions With Other Ar Particlesmentioning
confidence: 99%
“…In our calculations we use a ¼ 0.25, which is in agreement with the accommodation coefficient of Ar on a tungsten surface. 38,39 2.1.5 The final calculations. To calculate the final spatial distribution of Ar number density, both model and target particles must be simulated after collisions.…”
Section: To Simulate Collisions With Other Ar Particlesmentioning
confidence: 99%