The Technology of Microwave Integrated Circuits

Sobol, H.; Caulton, M.

doi:10.1016/b978-0-12-027908-1.50007-4

Cited by 13 publications

(2 citation statements)

References 27 publications

(23 reference statements)

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“…And at high frequencies, the conductor losses of composite-metal microstrip lines should also be considered carefully for a highly accurate model. To solve this problem, Sobol and Caulton [3], in the beginning, analyzed the conductor losses of composite-metal microstrip lines using a simplified TEM perturbation analysis based on an equivalent surface impedance concept [4]. Because the limit of the quasi-TEM wave approximation, these results are only available on low-frequency band, which have been pointed out by Wang and Tzuang [4].…”

Section: Introductionmentioning

confidence: 99%

The method of lines for the analysis of composite‐metal lossy microstrip lines

Gao

Tong

Gong

2010

Int J Numerical Modelling

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SUMMARYA full-wave analysis of the composite-metal microstrip lines is presented. The effects of the composite metal to the loss of the microstrip lines are accurately investigated, which are often avoided by other methods. The metal layers of the microstrip lines are considered as lossy inhomogeneous layers. The effects of the thickness of the Au layer and Ti layer are given, respectively. And the reasons that lead to the differences between them are discussed for the first time by analyzing the longitudinal electric field on the strip. The results are compared with other published data.

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Section: Introductionmentioning

confidence: 99%

The method of lines for the analysis of composite‐metal lossy microstrip lines

Gao

Tong

Gong

2010

Int J Numerical Modelling

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“…A 2-D periodic profile is normally employed to represent the rough surface in the analysis. In [4], the calculation of two-and three-layer metal systems was reported. All these analytical results can be applied to situations where the assumptions are held valid.…”

Section: Introductionmentioning

confidence: 99%

EM Modeling of Microstrip Conductor Losses Including Surface Roughness Effect

Chen¹

2007

IEEE Microw. Wireless Compon. Lett.

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This letter presents a method to model conductor losses in transmission lines utilizing a commercial full wave solver. The lines consist of multilayered metallization with inherent surface roughness. Metal thickness is assumed to be larger than skin depth. To validate accuracy of the modeling, the measurements of a 50-microstrip line and edge-coupled microstrip filter are provided, with random errors taken into account. Good correlation between the modeled results and measurements has been demonstrated from this comparison.

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Future of LTCCs

Multilayered Low Temperature Cofired Ceramics (LTCC) Technology

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The Technology of Microwave Integrated Circuits

Cited by 13 publications

References 27 publications

The method of lines for the analysis of composite‐metal lossy microstrip lines

The method of lines for the analysis of composite‐metal lossy microstrip lines

EM Modeling of Microstrip Conductor Losses Including Surface Roughness Effect

Future of LTCCs

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